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    Wafer Bonding Machine TORCH530
    • Wafer Bonding Machine TORCH530

    Wafer Bonding Machine TORCH530

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    1.Bonding areaφ300
    2.Mechanical pressure
    3.Bonding force1Mpa
    4.Vacuum
    5.Max temperature650°C
    6.Temperature uniformity±1.5%
    7.Heating rate40℃/min
    8.Cooling rate40℃/min
    9. Cooling wayWater cooling + nitrogen cooling
    10.Post-Sintering Shear Strength25-35Mpa
    11.Feeding way
    12.Voltage380V 50HZ
    13.Size
    常见问题1 2 3
    • Characteristic：

                                                       

      1.Bonding areaφ300
      2.Mechanical pressure
      3.Bonding force1Mpa
      4.Vacuum
      5.Max temperature650°C
      6.Temperature uniformity±1.5%
      7.Heating rate40℃/min
      8.Cooling rate40℃/min
      9. Cooling wayWater cooling + nitrogen cooling
      10.Post-Sintering Shear Strength25-35Mpa
      11.Feeding way
      12.Voltage380V 50HZ
      13.Size
      Wafer Bonding Machine TORCH530

    •                                                  

      1.Bonding areaφ300
      2.Mechanical pressure
      3.Bonding force1Mpa
      4.Vacuum
      5.Max temperature650°C
      6.Temperature uniformity±1.5%
      7.Heating rate40℃/min
      8.Cooling rate40℃/min
      9. Cooling wayWater cooling + nitrogen cooling
      10.Post-Sintering Shear Strength25-35Mpa
      11.Feeding way
      12.Voltage380V 50HZ
      13.Size
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