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    1.Bonding area≤12inch
    2.Mechanical pressure5T
    3.Bonding force0.4Mpa
    4.VacuumLimited 3Pa, working vacuum 10-200Pa
    5.Max temperature320℃
    6.Temperature uniformity≤±1%
    7.Heating rate20-40℃/min
    8.Cooling rate10-30℃/min
    9. Cooling wayWater cooling + nitrogen cooling
    10.Post-Sintering Shear Strength25-35Mpa
    11.Feeding wayManual
    12.Voltage380V, 25-50A
    13.Size
    常见问题1 2 3
    • Characteristic:

                                                       

      Wafer Bonding Machine-TORCH180
    •                                                  

    • 1.Bonding area≤12inch
      2.Mechanical pressure5T
      3.Bonding force0.4Mpa
      4.VacuumLimited 3Pa, working vacuum 10-200Pa
      5.Max temperature320℃
      6.Temperature uniformity≤±1%
      7.Heating rate20-40℃/min
      8.Cooling rate10-30℃/min
      9. Cooling wayWater cooling + nitrogen cooling
      10.Post-Sintering Shear Strength25-35Mpa
      11.Feeding wayManual
      12.Voltage380V, 25-50A
      13.Size
      1.Bonding area≤12inch
      2.Mechanical pressure5T
      3.Bonding force0.4Mpa
      4.VacuumLimited 3Pa, working vacuum 10-200Pa
      5.Max temperature320℃
      6.Temperature uniformity≤±1%
      7.Heating rate20-40℃/min
      8.Cooling rate10-30℃/min
      9. Cooling wayWater cooling + nitrogen cooling
      10.Post-Sintering Shear Strength25-35Mpa
      11.Feeding wayManual
      12.Voltage380V, 25-50A
      13.Size
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