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    Wafer Bonding Machine TORCH510
    • Wafer Bonding Machine TORCH510

    Wafer Bonding Machine TORCH510

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    1.Bonding area2-6inch
    2.Mechanical pressure10T(56T, 100T are optional)
    3.Bonding force2inch: max 50Mpa, 3inch max 22Mpa, 4inch max 12Mpa,5inch max 8Mpa,  6inch max 5.5Mpa
    4.Vacuum3Pa,working vacuum 10-200Pa,molecular pump 10-4Pa
    5.Max temperature320℃
    6.Temperature uniformity≤±1%
    7.Heating rate20-60℃/min
    8.Cooling rate10-30℃/min
    9. Cooling wayWater cooling + nitrogen cooling
    10.Post-Sintering Shear Strength25-35Mpa
    11.Feeding wayManual
    12.Voltage380V, 25-50A
    13.Size1000*80*2050mm
    常见问题1 2 3
    • Characteristic：

       

      1.Bonding area2-6inch
      2.Mechanical pressure10T(56T, 100T are optional)
      3.Bonding force2inch: max 50Mpa, 3inch max 22Mpa, 4inch max 12Mpa,5inch max 8Mpa,  6inch max 5.5Mpa
      4.Vacuum3Pa,working vacuum 10-200Pa,molecular pump 10-4Pa
      5.Max temperature320℃
      6.Temperature uniformity≤±1%
      7.Heating rate20-60℃/min
      8.Cooling rate10-30℃/min
      9. Cooling wayWater cooling + nitrogen cooling
      10.Post-Sintering Shear Strength25-35Mpa
      11.Feeding wayManual
      12.Voltage380V, 25-50A
      13.Size1000*80*2050mm
      Wafer Bonding Machine TORCH510

    •  

      1.Bonding area2-6inch
      2.Mechanical pressure10T(56T, 100T are optional)
      3.Bonding force2inch: max 50Mpa, 3inch max 22Mpa, 4inch max 12Mpa,5inch max 8Mpa,  6inch max 5.5Mpa
      4.Vacuum3Pa,working vacuum 10-200Pa,molecular pump 10-4Pa
      5.Max temperature320℃
      6.Temperature uniformity≤±1%
      7.Heating rate20-60℃/min
      8.Cooling rate10-30℃/min
      9. Cooling wayWater cooling + nitrogen cooling
      10.Post-Sintering Shear Strength25-35Mpa
      11.Feeding wayManual
      12.Voltage380V, 25-50A
      13.Size1000*80*2050mm
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