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    Die Bonders DB100
    • Die Bonders DB100

    Die Bonders DB100

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    1. Mount chip size0.2mm*0.2mm-20mm*20mm (max 50*50mm is optional)
    1. Mount accuracy±3um
    2. Feeding method2-inch waffle box*2 
    3. Working area150mm*150mm
    4. Nozzle pressureMax 200N，Min 2N 
    5.X Y Z axis resolution0.1um 
    6.R axis angle360°
    7. ConfigurationBonding, glue dispensing, UV curing, flip chip are optional
    8. Feeding wayManual
    9. Power supply220v，50Hz
    10. Weight430kg
    11. Size800 * 1000 * 1250mm 
    常见问题1 2 3
    • Characteristic：

       

      1. Mount chip size0.2mm*0.2mm-20mm*20mm (max 50*50mm is optional)
      1. Mount accuracy±3um
      2. Feeding method2-inch waffle box*2 
      3. Working area150mm*150mm
      4. Nozzle pressureMax 200N，Min 2N 
      5.X Y Z axis resolution0.1um 
      6.R axis angle360°
      7. ConfigurationBonding, glue dispensing, UV curing, flip chip are optional
      8. Feeding wayManual
      9. Power supply220v，50Hz
      10. Weight430kg
      11. Size800 * 1000 * 1250mm 
      Die Bonders DB100

    •  

      1. Mount chip size0.2mm*0.2mm-20mm*20mm (max 50*50mm is optional)
      1. Mount accuracy±3um
      2. Feeding method2-inch waffle box*2 
      3. Working area150mm*150mm
      4. Nozzle pressureMax 200N，Min 2N 
      5.X Y Z axis resolution0.1um 
      6.R axis angle360°
      7. ConfigurationBonding, glue dispensing, UV curing, flip chip are optional
      8. Feeding wayManual
      9. Power supply220v，50Hz
      10. Weight430kg
      11. Size800 * 1000 * 1250mm 
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