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    Die Bonders DB80H
    • Die Bonders DB80H

    Die Bonders DB80H

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    Die BondersDB80H
    1. Mount chip size0.5*0.5mm~20mm*20mm (50*50mm is optional)
    1. Mount accuracy±5um
    2. Feeding method2-inch waffle box*2
    3. Working area150mm*150mm
    4. Nozzle pressureMax 200N，Min 2N 
    5.X Y Z axis resolution1um 
    6.R axis angle360°
    7. ConfigurationBonding, glue dispensing, UV curing, flip chip are optional
    8. Feeding wayManual
    9. Power supply220v，50Hz
    10. Weight180kg
    11. Size800 * 800 * 950mm
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    • Characteristic：

       

      Die BondersDB80H
      1. Mount chip size0.5*0.5mm~20mm*20mm (50*50mm is optional)
      1. Mount accuracy±5um
      2. Feeding method2-inch waffle box*2
      3. Working area150mm*150mm
      4. Nozzle pressureMax 200N，Min 2N 
      5.X Y Z axis resolution1um 
      6.R axis angle360°
      7. ConfigurationBonding, glue dispensing, UV curing, flip chip are optional
      8. Feeding wayManual
      9. Power supply220v，50Hz
      10. Weight180kg
      11. Size800 * 800 * 950mm
      Die Bonders DB80H

    •  

      Die BondersDB80H
      1. Mount chip size0.5*0.5mm~20mm*20mm (50*50mm is optional)
      1. Mount accuracy±5um
      2. Feeding method2-inch waffle box*2
      3. Working area150mm*150mm
      4. Nozzle pressureMax 200N，Min 2N 
      5.X Y Z axis resolution1um 
      6.R axis angle360°
      7. ConfigurationBonding, glue dispensing, UV curing, flip chip are optional
      8. Feeding wayManual
      9. Power supply220v，50Hz
      10. Weight180kg
      11. Size800 * 800 * 950mm
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