Product Center

Research, development, production and sales of SMT production equipment and consumables
    Die Bonders DB200
    • Die Bonders DB200

    Die Bonders DB200

    service
    • Selected self-operated brands
    Inquire Now Contact Us

     

    Die BondersDB200
    1. Mount chip sizeResistors and capacitors larger than 01005, die and ICs smaller than 25mm; large ICs are optional
    1. Mount accuracy±7um(±5um/±3um are optional)
    2. Feeding methodFeeder Quantity: Maximum 46 units of 8mm GFTA feeders (including 16 short tape feeders); 12 units of 2-inch waffle packs; IC Tray Quantity: Maximum 3 units, then only 23 units of 8mm GFTA-08S feeders can be installed (see the configuration plan for details)
    3. Working area100*100mm
    4. Nozzle pressureMax 200N，Min 2N 
    5.X Y Z axis resolution1um 
    6.R axis angle360°
    7. ConfigurationBonding, glue dispensing, UV curing, flip chip are optional
    8. Feeding wayAutomatic
    9. Power supply220V,50Hz
    10. Weight350kg
    11. Size1100*1000*1500mm
    常见问题1 2 3
    • Characteristic：

       

      Die BondersDB200
      1. Mount chip sizeResistors and capacitors larger than 01005, die and ICs smaller than 25mm; large ICs are optional
      1. Mount accuracy±7um(±5um/±3um are optional)
      2. Feeding methodFeeder Quantity: Maximum 46 units of 8mm GFTA feeders (including 16 short tape feeders); 12 units of 2-inch waffle packs; IC Tray Quantity: Maximum 3 units, then only 23 units of 8mm GFTA-08S feeders can be installed (see the configuration plan for details)
      3. Working area100*100mm
      4. Nozzle pressureMax 200N，Min 2N 
      5.X Y Z axis resolution1um 
      6.R axis angle360°
      7. ConfigurationBonding, glue dispensing, UV curing, flip chip are optional
      8. Feeding wayAutomatic
      9. Power supply220V,50Hz
      10. Weight350kg
      Die Bonders DB200

    •  

      Die BondersDB200
      1. Mount chip sizeResistors and capacitors larger than 01005, die and ICs smaller than 25mm; large ICs are optional
      1. Mount accuracy±7um(±5um/±3um are optional)
      2. Feeding methodFeeder Quantity: Maximum 46 units of 8mm GFTA feeders (including 16 short tape feeders); 12 units of 2-inch waffle packs; IC Tray Quantity: Maximum 3 units, then only 23 units of 8mm GFTA-08S feeders can be installed (see the configuration plan for details)
      3. Working area100*100mm
      4. Nozzle pressureMax 200N，Min 2N 
      5.X Y Z axis resolution1um 
      6.R axis angle360°
      7. ConfigurationBonding, glue dispensing, UV curing, flip chip are optional
      8. Feeding wayAutomatic
      9. Power supply220V,50Hz
      10. Weight350kg
      11. Size1100*1000*1500mm
      • Follow us
      Tel
      Contact us
      苏ICP备2023016252号-1
      Online Service