Drawer-Type Nitrogen Lead-Free Reflow Oven — T200N+

Computer Control Operate the controller parameters via dedicated software to boost production efficiency, enabling soldering production for a diverse range of products. ▲ High Precision & Multi-Function It overcomes the drawbacks of compact reflow ovens such as cumbersome programming with instrument control, difficult parameter modification and limited temperature profile storage. Adopting self-developed temperature control software, it features intuitive temperature profile setup and massive profile storage capacity, with built-in analysis, statistics and printing functions. It fully meets the needs of soldering various products and recording experimental data of any volume, supporting batch setup of 40-segment temperature profiles. ▲ Visualized Operation, Real-Time Temperature Profile Display & Soldering Process Observation The temperature profile of each soldering process is detected in real time, with the actual profile displayed synchronously during soldering. This facilitates the adjustment and mastery of lead-free process profiles, especially the control of key stages such as the soaking zone and melting zone. ▲ Profile Analysis Function Both real-time detected temperature profiles and historical profiles are available for in-depth analysis, making it easy to modify and optimize the process profiles. Exclusive Advantages of T200N+ The T200N+ inherits all the advantages of the T200N, with the following upgraded and added features: Integrated with a single-channel temperature profile tester (multi-channel optional). Adopts the heater installation technology of bench-top reflow ovens for the entire machine, achieving more uniform temperature with a temperature uniformity of within 10℃. Incorporates the hot air circulation and exhaust technology of bench-top reflow ovens, effectively improving the temperature uniformity inside the oven and the diversion effect of hot air circulation. Adopts the chamber door transmission device of bench-top reflow ovens, ensuring no platform vibration when the PCB is output after soldering, and preventing chip displacement on the soldered PCB, thus effectively improving soldering quality. Features nitrogen-saving technology: nitrogen supply shuts off automatically when the chamber door is open and turns on automatically when the door is closed, effectively reducing nitrogen consumption during soldering and significantly lowering the operational cost. Equipped with an active smoke exhaust function for convenient discharge of waste gas after soldering. Added a filtration and purification function for the waste gas generated during soldering, making the operation more environmentally friendly. Adopts automatic door technology: the chamber door opens automatically after soldering, effectively improving production efficiency. Combined with a sealing device, the automatic door technology also enhances the heat preservation effect of the oven chamber and further achieves the goal of nitrogen saving.