The N10 is a 10-zone online nitrogen formic acid oven, designed to meet customers' production capacity requirements.With an oxygen content of less than 20 PPM, it is suitable for high-quality packaging and soldering of frame products and CLIP products.The N10 is equipped with 10 temperature zones each on the upper and lower parts, including three main zones: preheating zone, high-temperature soldering zone, and cooling zone. Meanwhile, the cooling zone is further divided into a high-temperature cooling zone and a low-temperature cooling zone. Each temperature zone is equipped with an independent temperature control system to realize separate control of a single zone.This equipment adopts both formic acid process and nitrogen process. The formic acid process can effectively remove the oxide film of the welded parts, and the nitrogen environment can prevent the workpieces from oxidizing during the soldering process. In the environment of nitrogen plus formic acid, the used solder paste does not need to contain activators, and there is no residue after soldering, which is extremely beneficial to the soldering of fine-pitch devices. The combination of nitrogen, solder paste and formic acid can break down oxides, obtain a pure surface of the base material, and achieve reliable soldering.1. Nitrogen reflow soldering involves filling the reflow oven chamber with nitrogen to block air from entering the oven, so as to prevent the oxidation of chips and frames during reflow soldering, as well as oxidation during preheating, soldering or cooling processes.2. Nitrogen reflow soldering involves filling the reflow oven chamber with nitrogen to block air from entering the oven, so as to prevent the oxidation of chips and frames during reflow soldering, as well as oxidation during preheating, soldering or cooling processes.3. In accordance with different customer requirements, Zhongke Tongzhi has developed a variety of nitrogen reflow ovens, among which the N10 is the most representative. The N10 is a multi-zone online device, suitable for high-quality packaging and soldering of frame products and CLIP products.