Silver Paste Pre-Baking System — N300A

The N300A is a bench-top offline device designed for small-batch production. It is mainly suitable for laboratories, research institutes, and customers with low production capacity requirements. The N300A features an automatic door opening and closing structure with an added door locking function for ease of operation. Meanwhile, the equipment's sealing structure is upgraded on the basis of traditional bench-top reflow ovens, delivering an overall better sealing performance to meet customers' demands for high-quality soldering. In addition, the N300A is equipped with bottom heating for a higher temperature rise rate and a significantly increased operating temperature. It is also fitted with two sets of temperature control systems. To ensure equipment stability during high-temperature soldering, the device is additionally equipped with a ventilation system and a built-in cooling circulation system. Key Features of Nitrogen Reflow Soldering A. Nitrogen reflow soldering involves filling the reflow oven chamber with nitrogen to block air ingress, which prevents the oxidation of component pins during reflow soldering, as well as the oxidation of solder pads and solder during preheating, soldering or cooling processes. B. The application of nitrogen reflow soldering is primarily to enhance soldering quality by conducting soldering in an environment with extremely low oxygen content (1000 PPM or even lower), thus avoiding component oxidation. Therefore, the core requirement for nitrogen reflow soldering is to minimize the oxygen content as much as possible. C. Zhongke Tongzhi has developed a variety of nitrogen reflow ovens to meet different customer needs, including bench-top offline devices, bench-top online devices and vertical online devices. The most representative one is the N300A — a bench-top offline device ideal for small-batch production scenarios such as laboratories and research institutes.