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    Vacuum Plasma Cleaner (Offline) — VPC3i
    • Vacuum Plasma Cleaner (Offline) — VPC3i

    Vacuum Plasma Cleaner (Offline) — VPC3i

    The software control system features simple operation, enabling direct equipment control and the setting of various cleaning process curves, as well as the setting, modification, storage and recall of parameters for different processes. The software has a built-in analysis function for process curve analysis, and automatically records cleaning process, temperature curve, time and alarm-related data in real time, ensuring the traceability of product cleaning processes. The equipment requires no calibration, eliminating additional calibration costs.

    The software control system features simple operation, enabling direct equipment control and the setting of various cleaning process curves, as well as the setting, modification, storage and recall of parameters for different processes. The software has a built-in analysis function for process curve analysis, and automatically records cleaning process, temperature curve, time and alarm-related data in real time, ensuring the traceability of product cleaning processes. The equipment requires no calibration, eliminating additional calibration costs. Operating power consumption: 2.2KW (excluding water chiller power consumption) Equipped with an over-temperature alarm and recording function (standard configuration). The VPC3i vacuum plasma cleaner is equipped with over-temperature protection and alarm functions for the workpiece surface during cleaning, as well as temperature safety protection and recording functions for the entire equipment. Configurable with a flow rate management and analysis system (software + hardware) for nitrogen, argon and other gases (optional). The VPC3i vacuum plasma cleaner features real-time management and analysis of the consumption of process gases such as nitrogen and argon by the entire equipment, which can record and analyze real-time, daily, weekly and time-period gas usage. Configurable with a process gas pressure alarm and analysis system (software + hardware) (optional). The VPC3i vacuum plasma cleaner has under-pressure alarm, recording and analysis functions for the process gas source during production, which is extremely useful for product quality traceability. Configurable with an energy management and analysis system (software + hardware) (optional). The VPC3i vacuum plasma cleaner features real-time energy consumption management and analysis, which can record and analyze real-time, daily, weekly and time-period power consumption. Configurable with an oxygen content management and analysis system (software + hardware) (optional). The VPC3i vacuum plasma cleaner has real-time management and analysis of the oxygen content in the vacuum chamber, which can record and analyze oxygen content in PPM for product quality traceability and analysis. Configurable with an MES data interface subsystem (software + hardware) (optional). The VPC3i vacuum plasma cleaner is equipped with an MES data interface function, which can be optionally configured with an MES system to complete various data collection and analysis for intelligent equipment.

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    Vacuum Plasma Cleaner (Offline) — VPC3i

    The software control system features simple operation, enabling direct equipment control and the setting of various cleaning process curves, as well as the setting, modification, storage and recall of parameters for different processes. The software has a built-in analysis function for process curve analysis, and automatically records cleaning process, temperature curve, time and alarm-related data in real time, ensuring the traceability of product cleaning processes. The equipment requires no calibration, eliminating additional calibration costs.

    Vacuum Plasma Cleaner — VPC100

    It is mainly applied to plasma surface treatment processes in the semiconductor packaging field for silicon wafers, glass substrates, ceramic substrates, IC carriers, copper lead frames, large-size single-sided power substrates, IGBT modules, jig-equipped MEMS sensors, microwave devices, filters, RF devices and other components.

    Vacuum Plasma Cleaner (Offline) — VPC42

    The VPC42 series vacuum plasma cleaner is a plasma surface treatment device tailored for R&D and small-batch industrial production scenarios. It comes with a comprehensive configuration and a stratifiable vacuum chamber, making it adaptable to most production conditions. It is suitable for a variety of applications including plasma cleaning, activation and etching, and is mainly applied to plasma surface treatment processes in the semiconductor packaging field for silicon wafers, glass substrates, ceramic substrates, IC carriers, copper lead frames, large-size single-sided power substrates, IGBT modules, jig-equipped MEMS sensors, microwave devices, filters, RF devices and more. The equipment features stable operation, with excellent repeatability and consistency in product processing.
    The software control system fe...
    It is mainly applied to plasma...
    The VPC42 series vacuum plasma...
    • The software control system features simple operation, enabling direct equipment control and the setting of various cleaning process curves, as well as the setting, modification, storage and recall of parameters for different processes. The software has a built-in analysis function for process curve analysis, and automatically records cleaning process, temperature curve, time and alarm-related data in real time, ensuring the traceability of product cleaning processes. The equipment requires no calibration, eliminating additional calibration costs. Operating power consumption: 2.2KW (excluding water chiller power consumption) Equipped with an over-temperature alarm and recording function (standard configuration). The VPC3i vacuum plasma cleaner is equipped with over-temperature protection and alarm functions for the workpiece surface during cleaning, as well as temperature safety protection and recording functions for the entire equipment. Configurable with a flow rate management and analysis system (software + hardware) for nitrogen, argon and other gases (optional). The VPC3i vacuum plasma cleaner features real-time management and analysis of the consumption of process gases such as nitrogen and argon by the entire equipment, which can record and analyze real-time, daily, weekly and time-period gas usage. Configurable with a process gas pressure alarm and analysis system (software + hardware) (optional). The VPC3i vacuum plasma cleaner has under-pressure alarm, recording and analysis functions for the process gas source during production, which is extremely useful for product quality traceability. Configurable with an energy management and analysis system (software + hardware) (optional). The VPC3i vacuum plasma cleaner features real-time energy consumption management and analysis, which can record and analyze real-time, daily, weekly and time-period power consumption. Configurable with an oxygen content management and analysis system (software + hardware) (optional). The VPC3i vacuum plasma cleaner has real-time management and analysis of the oxygen content in the vacuum chamber, which can record and analyze oxygen content in PPM for product quality traceability and analysis. Configurable with an MES data interface subsystem (software + hardware) (optional). The VPC3i vacuum plasma cleaner is equipped with an MES data interface function, which can be optionally configured with an MES system to complete various data collection and analysis for intelligent equipment.

    Vacuum Plasma Cleaner (Offline) — VPC3i

    The software control system features simple operation, enabling direct equipment control and the setting of various cleaning process curves, as well as the setting, modification, storage and recall of parameters for different processes. The software has a built-in analysis function for process curve analysis, and automatically records cleaning process, temperature curve, time and alarm-related data in real time, ensuring the traceability of product cleaning processes. The equipment requires no calibration, eliminating additional calibration costs.

    Vacuum Plasma Cleaner — VPC100

    It is mainly applied to plasma surface treatment processes in the semiconductor packaging field for silicon wafers, glass substrates, ceramic substrates, IC carriers, copper lead frames, large-size single-sided power substrates, IGBT modules, jig-equipped MEMS sensors, microwave devices, filters, RF devices and other components.

    Vacuum Plasma Cleaner (Offline) — VPC42

    The VPC42 series vacuum plasma cleaner is a plasma surface treatment device tailored for R&D and small-batch industrial production scenarios. It comes with a comprehensive configuration and a stratifiable vacuum chamber, making it adaptable to most production conditions. It is suitable for a variety of applications including plasma cleaning, activation and etching, and is mainly applied to plasma surface treatment processes in the semiconductor packaging field for silicon wafers, glass substrates, ceramic substrates, IC carriers, copper lead frames, large-size single-sided power substrates, IGBT modules, jig-equipped MEMS sensors, microwave devices, filters, RF devices and more. The equipment features stable operation, with excellent repeatability and consistency in product processing.
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