Vacuum Plasma Cleaner — VPC100

It is mainly applied to plasma surface treatment processes in the semiconductor packaging field for silicon wafers, glass substrates, ceramic substrates, IC carriers, copper lead frames, large-size single-sided power substrates, IGBT modules, jig-equipped MEMS sensors, microwave devices, filters, RF devices and other components. The software control system features simple operation, enabling direct equipment control and setting of various cleaning process curves, as well as the setting, modification, storage and recall of parameters for different processes. The software has a built-in analysis function for process curve analysis, and automatically records cleaning process, temperature curve, time and alarm-related data in real time, ensuring the traceability of product cleaning processes. The equipment requires no calibration, eliminating additional calibration costs. Equipped with an over-temperature alarm and recording function (standard configuration). Has over-temperature protection and alarm functions for the workpiece surface during cleaning, as well as temperature safety protection and recording functions for the entire equipment. Configurable with a flow rate management and analysis system (software + hardware) for nitrogen, argon and other gases (optional). The vacuum plasma cleaner is equipped with a real-time management and analysis function for the consumption of process gases such as nitrogen and argon by the entire equipment, which can conduct real-time recording and analysis of gas consumption including real-time, daily, weekly and time-period usage. Configurable with a process gas pressure alarm and analysis system (software + hardware) (optional). Features under-pressure alarm and recording functions for the process gas source during production, which is extremely useful for product quality traceability. Configurable with an energy management and analysis system (software + hardware) (optional). Has a real-time energy consumption management and analysis function, which can record and analyze real-time, daily, weekly and time-period power consumption. Configurable with an energy management and analysis system (software + hardware) and an oxygen content management and analysis system (software + hardware) (both optional). Equipped with a real-time management and analysis function for the oxygen content in the vacuum chamber of the entire equipment, which can conduct real-time recording and analysis of oxygen content in PPM, applicable to product quality traceability and analysis. Configurable with an MES data interface subsystem (software + hardware) (optional). The MES data interface function of the entire equipment can be optionally configured with an MES system to complete various data collection and analysis for intelligent equipment.