Vacuum Plasma Cleaner VPC42 (offiline)

The software control system features simple operation, enabling direct equipment control and the setting of various cleaning process curves, as well as the setting, modification, storage and recall of parameters for different processes. The software has a built-in analysis function for process curve analysis, and automatically records cleaning process, temperature curve, time and alarm-related data in real time, ensuring the traceability of product cleaning processes. The equipment requires no calibration, eliminating additional calibration costs.

It is mainly applied to plasma surface treatment processes in the semiconductor packaging field for silicon wafers, glass substrates, ceramic substrates, IC carriers, copper lead frames, large-size single-sided power substrates, IGBT modules, jig-equipped MEMS sensors, microwave devices, filters, RF devices and other components.

The VPC42 series vacuum plasma cleaner is a plasma surface treatment device tailored for R&D and small-batch industrial production scenarios. It comes with a comprehensive configuration and a stratifiable vacuum chamber, making it adaptable to most production conditions. It is suitable for a variety of applications including plasma cleaning, activation and etching, and is mainly applied to plasma surface treatment processes in the semiconductor packaging field for silicon wafers, glass substrates, ceramic substrates, IC carriers, copper lead frames, large-size single-sided power substrates, IGBT modules, jig-equipped MEMS sensors, microwave devices, filters, RF devices and more. The equipment features stable operation, with excellent repeatability and consistency in product processing.