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    Hot Cold Separated Vacuum Soldering Oven -V3D

    Hot Cold Separated Vacuum Soldering Oven -V3D
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    • Characteristic：

                                               

      1. Soldering area300mm×300mm
      2. Temperature rangeMax 600℃
      3. Vacuum0.3Pa with mechnical pump, 10-3Pa with molecular pump
      4. Temperature uniformity±1%
      5. Heating rate≥150℃/min
      6. Cooling rate≥200℃/min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight320KG
      10. Size900*1100*1300mm
      11. Power supply380V,25-50A
      Hot Cold Separated Vacuum Soldering Oven -V3D

    •                                          

      1. Soldering area300mm×300mm
      2. Temperature rangeMax 600℃
      3. Vacuum0.3Pa with mechnical pump, 10-3Pa with molecular pump
      4. Temperature uniformity±1%
      5. Heating rate≥150℃/min
      6. Cooling rate≥200℃/min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight320KG
      10. Size900*1100*1300mm
      11. Power supply380V,25-50A
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