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    Water & Nitrogen Cooling Vacuum Soldering Oven RS330

    Water & Nitrogen Cooling Vacuum Soldering Oven RS330
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    • Characteristic：

       

      1. Soldering area330mm×330mm
      2. Temperature range450℃, higher is optional
      3. Vacuum0.5 -1.5Pa with mechnical pump, 10-3Pa with molecular pump
      4. Temperature uniformity±0.5% - ±1.5%
      5. Heating rate120K/min
      6. Cooling rate80k/min —120K/min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialGraphite
      9. Weight280KG
      10. Size1000*1000*1600mm
      11. Power supply380V 50A 
      Water & Nitrogen Cooling Vacuum Soldering Oven RS330

    •  

      1. Soldering area330mm×330mm
      2. Temperature range450℃, higher is optional
      3. Vacuum0.5 -1.5Pa
      4. Temperature uniformity±0.5% - ±1.5%
      5. Heating rate120K/min
      6. Cooling rate80k/min —120K/min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialGraphite
      9. Weight280KG
      10. Size1000*1000*1600mm
      11. Power supply380V 50A 
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