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    Hot Cold Separated Vacuum Soldering Oven-V4D

    Hot Cold Separated Vacuum Soldering Oven-V4D
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    • Characteristic：

                                               

      1. Soldering area380mm×310mm
      2. Temperature rangeMax 600℃
      3. Vacuum10Pa with mechnical pump, 10-3Pa with molecular pump
      4. Temperature uniformity±2%
      5. Heating rate≤120℃/min
      6. Cooling rate≤150℃/min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight320KG
      10. Size900*1100*1300mm
      11. Power supply380V,25-50A
      Hot Cold Separated Vacuum Soldering Oven-V4D

    •                                          

      1. Soldering area380mm×310mm
      2. Temperature rangeMax 600℃
      3. Vacuum10Pa with mechnical pump, 10-3Pa with molecular pump
      4. Temperature uniformity±2%
      5. Heating rate≤120℃/min
      6. Cooling rate≤150℃/min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight320KG
      10. Size900*1100*1300mm
      11. Power supply380V,25-50A
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