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Hot Cold Separated Vacuum Soldering Oven-V5D

Characteristic：

1. Soldering area	500mm×350mm
2. Temperature range	Max 450℃, higher is optional
3. Vacuum	5Pa with mechnical pump, 10-3Pa with molecular pump
4. Temperature uniformity	±2%
5. Heating rate	≤180℃/min
6. Cooling rate	≤120℃/min
7. Cooling way	Water cooling + nitrogen cooling
8. Heating plate material	Silicon carbide coated Graphite plate
9. Weight	650KG
10. Size	120010001950mm
11. Power supply	380V,25-50A

1. Soldering area	500mm×350mm
2. Temperature range	Max 450℃, higher is optional
3. Vacuum	5Pa with mechnical pump, 10-3Pa with molecular pump
4. Temperature uniformity	±2%
5. Heating rate	≤180℃/min
6. Cooling rate	≤120℃/min
7. Cooling way	Water cooling + nitrogen cooling
8. Heating plate material	Silicon carbide coated Graphite plate
9. Weight	650KG
10. Size	120010001950mm
11. Power supply	380V,25-50A