Product Center

Research, development, production and sales of SMT production equipment and consumables

    Offline Vacuum Reflow Oven-H3

    Offline Vacuum Reflow Oven-H3
    Share to:
    • Characteristic：

                                               

      1. Soldering area600mm*250mm*3 layer
      2. Temperature rangeMax 450℃
      3. Vacuum≤10Pa
      4. Temperature uniformity±3%
      5. Heating rate≤100℃/Min
      6. Cooling rate≤80℃/Min
      7. Cooling wayWater cooling
      8. Heating plate materialGraphite plate
      9. Weight800Kg
      10. Size1350*1000*1830mm
      11. Power supply380V 25-50A
      Offline Vacuum Reflow Oven-H3

    •                                          

      1. Soldering area600mm*250mm*3 layer
      2. Temperature rangeMax 450℃
      3. Vacuum≤10Pa
      4. Temperature uniformity±3%
      5. Heating rate≤100℃/Min
      6. Cooling rate≤80℃/Min
      7. Cooling wayWater cooling
      8. Heating plate materialGraphite plate
      9. Weight800Kg
      10. Size1350*1000*1830mm
      11. Power supply380V 25-50A
    Follow us
    Tel
    Contact us
    苏ICP备2023016252号-1
    Online Service