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    Offline Vacuum Reflow Oven-H5

    Offline Vacuum Reflow Oven-H5
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      1. Soldering area500mm*300mm*100mm*5 layer
      2. Temperature range350℃ -450℃
      3. Vacuum≤10Pa
      4. Temperature uniformity±3%
      5. Heating rate≤100℃/Min
      6. Cooling rate≤80℃/Min
      7. Cooling wayWater cooling
      8. Heating plate materialGraphite plate
      9. Weight1150KG
      10. Size1600*1000*1830mm
      11. Power supply380V 50-60A
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