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    Inline Vacuum Formic Acid Oven — V8S
    • Inline Vacuum Formic Acid Oven — V8S

    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste and other solder paste formulations of all compositions. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: 2% Note: Different soldering materials and atmospheres will affect the soldering results. The above data is a comprehensive summary based on customer tests, and specific values may vary for different soldering products. Key Functional Features Supports nitrogen atmosphere operation to meet the requirements of multiple soldering processes. Equipped with a software control system with a modular design and a concise, user-friendly operation interface. No calibration is required for the equipment, eliminating additional calibration costs.


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    Thermal Separation Vacuum Eutectic Furnace — V3D

    Soldering Temperature Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height 100 mm

    Thermal Separation Vacuum Eutectic Furnace — V4D

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height 100 mm

    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.

    Vacuum Formic Acid Oven V8-200

    The V8-200 Vacuum Formic Acid Reflow Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8-200 is specially optimized and designed for the vacuum soldering and packaging needs of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address common challenges faced by industry customers.

    Inline Formic Acid High-Vacuum Sintering Furnace — VX610

    The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with the single-layer vacuum chambers of similar equipment. This double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.
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    The V8S/V8H Inline Vacuum Sold...
    The V8-200 Vacuum Formic Acid ...
    • The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste and other solder paste formulations of all compositions. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: 2% Note: Different soldering materials and atmospheres will affect the soldering results. The above data is a comprehensive summary based on customer tests, and specific values may vary for different soldering products. Key Functional Features Supports nitrogen atmosphere operation to meet the requirements of multiple soldering processes. Equipped with a software control system with a modular design and a concise, user-friendly operation interface. No calibration is required for the equipment, eliminating additional calibration costs.


    Thermal Separation Vacuum Eutectic Furnace — V3D

    Soldering Temperature Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height 100 mm

    Thermal Separation Vacuum Eutectic Furnace — V4D

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height 100 mm

    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.

    Vacuum Formic Acid Oven V8-200

    The V8-200 Vacuum Formic Acid Reflow Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8-200 is specially optimized and designed for the vacuum soldering and packaging needs of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address common challenges faced by industry customers.

    Inline Formic Acid High-Vacuum Sintering Furnace — VX610

    The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with the single-layer vacuum chambers of similar equipment. This double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.
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