The V8-200 Vacuum Formic Acid Reflow Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8-200 is specially optimized and designed for the vacuum soldering and packaging needs of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address common challenges faced by industry customers. Core Advantages High Output: Up to 120–130 frames per hour (calculated based on soldering time per temperature zone). Low Energy Consumption: Total startup power: 18 KW; Average operating power: 6 KW. Low Nitrogen Consumption: Nitrogen usage is only 1/4–1/5 that of comparable vacuum ovens. Compact Footprint: Overall dimensions: 3300 × 1000 × 1300 mm. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste, and other solder paste formulations. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: 2% Note: Different soldering materials and atmospheres will affect results. These values are based on comprehensive customer testing and may vary by product. Key Functional Features Supports nitrogen atmosphere operation to accommodate multiple soldering processes. Equipped with a software control system featuring a modular design and an intuitive, user-friendly interface. Requires no calibration, eliminating additional calibration costs.