Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height 100 mm Heating Method Adopts bottom + top infrared radiation heating. The heating plate features a semiconductor-grade graphite-coated silicon carbide platform, which is resistant to deformation during long-term use and boasts high thermal conductivity for more uniform surface temperature of the heating plate. Temperature Uniformity ≤ ±2% within the effective soldering area Maximum Temperature Rise Rate 120℃/min The V4D is equipped with upper heating, which not only improves heating efficiency but also ensures more uniform platform temperature, enhancing soldering consistency and quality. Maximum Cooling Rate 120℃/min (Range: from no-load maximum temperature to 150℃) Silicon Carbide Heating Platform Adopts a combined air-water cooling method to achieve rapid cooling of the heating plate, increase the cooling rate, and prevent poor device sintering caused by excessive temperature difference during the cooling process. Solder Compatibility Suitable for soldering with various solders (≤ 450℃), including preformed solder foils such as In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37 and Sn62Pb36Ag2 (enabling flux-free eutectic soldering), as well as solder pastes of all compositions. Soldering Void Ratio Validated by numerous customers, the V4D can control the void ratio to below 2% for soft solder soldering. Optional Positive Pressure Module The furnace can be equipped with an optional positive pressure module (≤ 0.2 Mpa), supporting both positive and negative pressure processes. The positive pressure process can effectively solve the displacement of micro-devices during soldering (e.g., MiniLED, MicroLED) and the flux splashing issue in solder paste processes (e.g., lead frame products). Temperature Control & Measurement System Adopts advanced temperature control technology with a control accuracy of ±1℃. Allows setting of up to 40 temperature segments for the temperature profile, and is configured with 3 groups of PID settings (6 groups optional) for more precise temperature control, ensuring soldering consistency and reliability. Temperature control is a lagging control, while PID control features predictive regulation, which improves control accuracy and stability. The furnace chamber is standard-equipped with 2 sets of temperature-measuring thermocouples. During operation, the thermocouples can real-time feed back the temperature at any position in the chamber, and the temperature measurement curve is displayed in real time on the control software. This ensures better temperature control of the soldering area and provides support for formulating an optimal process profile. Furnace Chamber Atmosphere The V4D can be filled with nitrogen (an inert gas) for auxiliary soldering, and also supports reductive atmosphere processes such as formic acid and nitrogen-hydrogen mixture (5% H₂ + 95% N₂). The process atmosphere can be precisely controlled by time or MFC (Mass Flow Controller) to ensure the consistency of each set process execution, and it enables flux-free soldering. Software Control System Based on the Windows operating system with simple and intuitive operation. Supports process programming by setting process parameters including temperature, time, pressure and vacuum; the software automatically controls the entire soldering process. Allows an unlimited number of process actions in process profile programming to meet complex process requirements. Supports the setting, modification, storage and retrieval of various soldering process profiles for different processes. Built-in analysis function that can analyze process profiles and identify key information such as temperature rise, constant temperature and cooling stages. Automatically records the soldering process and temperature control/measurement curves in real time to ensure the process traceability of devices; all data is automatically saved in the corresponding directory according to the process operation time. Structural Features Adopts a fully automatic closed chamber structure to ensure reliable long-term use. The upper cover closes automatically without causing device displacement, avoiding the impact of device vibration on soldering quality. The single-chamber design supports both heating and cooling processes. The upper cover is equipped with a viewing window for observing the device sintering process via a microscope. The upper cover is automatically lifted and lowered; all operations except manual loading and unloading are completed by automatic software control. The heating plate is made of pure material without additional structures such as cold water pipes, ensuring more uniform temperature. Adopts the water cooling technology of Zhongke Tongzhi: water cooling does not affect the temperature uniformity of the thermal field during heating; each heating plate is equipped with six independent water cooling devices during cooling, ensuring higher temperature uniformity in the cooling process. It is especially suitable for high-quality packaging and soldering such as AuSn eutectic soldering and indium solder eutectic soldering. Standard Configuration Main unit × 1 Industrial-grade control computer × 1 Vacuum sintering furnace control software system × 1 set Nitrogen atmosphere system + Formic acid atmosphere system Mass Flow Controller (MFC) × 1 Graphite-coated silicon carbide heating platform × 1 Optional Configuration Vacuum pump (mechanical dry pump) Turbomolecular pump system Digital nitrogen-hydrogen mixture atmosphere system Positive pressure module CCD vision system / Microscope Nitrogen-hydrogen mixture atmosphere system
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