Product Center

Research, development, production and sales of SMT production equipment and consumables
    Wafer Bonder - TORCH520
    • Wafer Bonder - TORCH520

    Wafer Bonder - TORCH520

    Alignment and wafer bonding are core processes for wafer-level capping, wafer-level packaging, engineered substrate manufacturing, wafer-level 3D integration, and wafer thinning. These processes have driven the remarkable growth of MEMS devices, RF filters, and BSI (Back-Side Illuminated) CIS (CMOS Image Sensors). Additionally, they enable the fabrication of engineered substrates such as SOI (Silicon on Insulator). Mainstream bonding processes include: adhesive bonding, anodic bonding, direct/fusion bonding, glass frit bonding, solder bonding (including eutectic and transient liquid phase bonding), and metal diffusion/thermocompression bonding.
    service
    • Selected self-operated brands
    Inquire Now Contact Us

    Alignment and wafer bonding are core processes for wafer-level capping, wafer-level packaging, engineered substrate manufacturing, wafer-level 3D integration, and wafer thinning. These processes have driven the remarkable growth of MEMS devices, RF filters, and BSI (Back-Side Illuminated) CIS (CMOS Image Sensors). Additionally, they enable the fabrication of engineered substrates such as SOI (Silicon on Insulator). Mainstream bonding processes include: adhesive bonding, anodic bonding, direct/fusion bonding, glass frit bonding, solder bonding (including eutectic and transient liquid phase bonding), and metal diffusion/thermocompression bonding. The TORCH520 Bonder is primarily designed for 8-inch (D200mm) wafer bonding. It achieves wafer bonding through uniform pressure application and precise displacement control under thermal conditions. The equipment offers optional pressurization processes in low vacuum (0.1 mbar) or high vacuum (1E-6 mbar), with a maximum pressure of 60 KN and a maximum heating temperature of 650°C under pressurization. It can meet a temperature ramp-up/ramp-down rate requirement of 40K/min, and provides positive pressure atmosphere protection at the end of the process, with a protective pressure up to 3 bar. The system features an ergonomically designed top-opening upper and lower chamber structure, and is equipped with a closed-loop water chiller for rapid cooling via circulating water. An optional formic acid cleaning process is available prior to bonding. Specifications Number of chambers: 1 Temperature control: Independent temperature control for upper and lower pressure heads Chamber opening mode: Ergonomically designed top-opening chamber System cooling: Circulating water cooling with a closed-loop water cooling heat exchanger Optional configurations: Pressurization protection; formic acid atmosphere

    常见问题1 2 3
    Related product recommendation
    Wafer Bonder - TORCH520

    Wafer Bonder - TORCH520

    Alignment and wafer bonding are core processes for wafer-level capping, wafer-level packaging, engineered substrate manufacturing, wafer-level 3D integration, and wafer thinning. These processes have driven the remarkable growth of MEMS devices, RF filters, and BSI (Back-Side Illuminated) CIS (CMOS Image Sensors). Additionally, they enable the fabrication of engineered substrates such as SOI (Silicon on Insulator). Mainstream bonding processes include: adhesive bonding, anodic bonding, direct/fusion bonding, glass frit bonding, solder bonding (including eutectic and transient liquid phase bonding), and metal diffusion/thermocompression bonding.
    Wafer Bonder - TORCH530

    Wafer Bonder - TORCH530

    Alignment and wafer bonding are core processes for wafer-level capping, wafer-level packaging, engineered substrate manufacturing, wafer-level 3D integration and wafer thinning. These processes have driven the remarkable growth of MEMS devices, RF filters and BSI (Back-Side Illuminated) CIS (CMOS Image Sensors). In addition, they enable the fabrication of engineered substrates such as SOI (Silicon on Insulator). The mainstream bonding processes include: adhesive bonding, anodic bonding, direct/fusion bonding, glass frit bonding, solder bonding (including eutectic and transient liquid phase bonding), and metal diffusion/thermocompression bonding.
    Thermocompression Bonding Machine — TCB350

    Thermocompression Bonding Machine — TCB350

    TCB350 Thermocompression Bonding Machine (Hot Pressing Bonding) TCB thermocompression bonding is an evolution of the standard flip-chip process, mainly used to complete the bump thermocompression bonding process of chip-to-wafer and chip-to-PCB (and other substrates). At present, this equipment has achieved thermocompression bonding of large-size (50/70mm) bare chips. The maximum size applicable to the substrate vacuum adsorption heating device can reach 300*300mm.
    Wafer Bonder - TORCH180

    Wafer Bonder - TORCH180

    The TORCH180 Wafer Bonder is primarily driven by mechanical pressure. For the pressure application unit, this design adopts a precision pneumatic control system and a self-developed positive pressure air bag mechanism to achieve high-precision pressure exertion.
    Wafer Bonder - ...
    Wafer Bonder - TORCH520
    Alignment and wafer bonding ar...
    Wafer Bonder - ...
    Wafer Bonder - TORCH530
    Alignment and wafer bonding ar...
    Thermocompressi...
    Thermocompression Bonding Machine — TCB350
    TCB350 Thermocompression Bondi...
    Wafer Bonder - ...
    Wafer Bonder - TORCH180
    The TORCH180 Wafer Bonder is p...
    • Wafer Bonder - TORCH520

    • Alignment and wafer bonding are core processes for wafer-level capping, wafer-level packaging, engineered substrate manufacturing, wafer-level 3D integration, and wafer thinning. These processes have driven the remarkable growth of MEMS devices, RF filters, and BSI (Back-Side Illuminated) CIS (CMOS Image Sensors). Additionally, they enable the fabrication of engineered substrates such as SOI (Silicon on Insulator). Mainstream bonding processes include: adhesive bonding, anodic bonding, direct/fusion bonding, glass frit bonding, solder bonding (including eutectic and transient liquid phase bonding), and metal diffusion/thermocompression bonding. The TORCH520 Bonder is primarily designed for 8-inch (D200mm) wafer bonding. It achieves wafer bonding through uniform pressure application and precise displacement control under thermal conditions. The equipment offers optional pressurization processes in low vacuum (0.1 mbar) or high vacuum (1E-6 mbar), with a maximum pressure of 60 KN and a maximum heating temperature of 650°C under pressurization. It can meet a temperature ramp-up/ramp-down rate requirement of 40K/min, and provides positive pressure atmosphere protection at the end of the process, with a protective pressure up to 3 bar. The system features an ergonomically designed top-opening upper and lower chamber structure, and is equipped with a closed-loop water chiller for rapid cooling via circulating water. An optional formic acid cleaning process is available prior to bonding. Specifications Number of chambers: 1 Temperature control: Independent temperature control for upper and lower pressure heads Chamber opening mode: Ergonomically designed top-opening chamber System cooling: Circulating water cooling with a closed-loop water cooling heat exchanger Optional configurations: Pressurization protection; formic acid atmosphere

    Wafer Bonder - TORCH520

    Wafer Bonder - TORCH520

    Alignment and wafer bonding are core processes for wafer-level capping, wafer-level packaging, engineered substrate manufacturing, wafer-level 3D integration, and wafer thinning. These processes have driven the remarkable growth of MEMS devices, RF filters, and BSI (Back-Side Illuminated) CIS (CMOS Image Sensors). Additionally, they enable the fabrication of engineered substrates such as SOI (Silicon on Insulator). Mainstream bonding processes include: adhesive bonding, anodic bonding, direct/fusion bonding, glass frit bonding, solder bonding (including eutectic and transient liquid phase bonding), and metal diffusion/thermocompression bonding.
    Wafer Bonder - TORCH530

    Wafer Bonder - TORCH530

    Alignment and wafer bonding are core processes for wafer-level capping, wafer-level packaging, engineered substrate manufacturing, wafer-level 3D integration and wafer thinning. These processes have driven the remarkable growth of MEMS devices, RF filters and BSI (Back-Side Illuminated) CIS (CMOS Image Sensors). In addition, they enable the fabrication of engineered substrates such as SOI (Silicon on Insulator). The mainstream bonding processes include: adhesive bonding, anodic bonding, direct/fusion bonding, glass frit bonding, solder bonding (including eutectic and transient liquid phase bonding), and metal diffusion/thermocompression bonding.
    Thermocompression Bonding Machine — TCB350

    Thermocompression Bonding Machine — TCB350

    TCB350 Thermocompression Bonding Machine (Hot Pressing Bonding) TCB thermocompression bonding is an evolution of the standard flip-chip process, mainly used to complete the bump thermocompression bonding process of chip-to-wafer and chip-to-PCB (and other substrates). At present, this equipment has achieved thermocompression bonding of large-size (50/70mm) bare chips. The maximum size applicable to the substrate vacuum adsorption heating device can reach 300*300mm.
    Wafer Bonder - TORCH180

    Wafer Bonder - TORCH180

    The TORCH180 Wafer Bonder is primarily driven by mechanical pressure. For the pressure application unit, this design adopts a precision pneumatic control system and a self-developed positive pressure air bag mechanism to achieve high-precision pressure exertion.
    Follow us
    Tel
    Contact us
    苏ICP备2023016252号-1
    Online Service