Zhongke Tongzhi Technology Shines at 2024 CIOE, Joining the Grand Event of Semiconductor Packaging Technology

Zhongke Tongzhi Invites You to SEMI-e 2025 Shenzhen International Semiconductor Exhibition to Unlock the Innovative Power of Semiconductor Packaging Equipment From September 10 to 12, 2025, SEMI-e 2025 The 7th Shenzhen International Semiconductor Exhibition & 2025 IC Industry Innovation Exhibition will grandly kick off at Shenzhen World Exhibition & Convention Center (Bao'an New Site). As a highly influential and professional event in the semiconductor industry, Zhongke Tongzhi Semiconductor (Jiangsu) Co., Ltd. sincerely invites you to visit our booth 14L29 (near Gate 14 of Hall 12), to explore cutting-edge industry trends and witness the technological breakthroughs of domestic semiconductor packaging equipment. I. Core Value of the Exhibition: Full Industry Chain Coverage, Cross-border Synergy Empowerment Based on the industry frontier and with "Building a New Ecosystem of Industrial Synergy" as the core, the exhibition creates a one-stop communication and cooperation platform in the semiconductor field with outstanding highlights: Full industry chain ecological layout: Gathers over 1,000 high-quality global exhibitors, covering the complete industrial chain from EDA tools, semiconductor materials and equipment manufacturing to chip design, packaging and testing applications. It sets up seven themed exhibition areas including chip design and application, IC manufacturing, wafer equipment, packaging and testing equipment, core components and materials, compound semiconductors and power devices, and AI computing power, accurately matching the needs of semiconductor manufacturing, integrated circuits, automotive electronics, consumer electronics and other fields. Optoelectronics + Semiconductor cross-border linkage: Held concurrently and at the same venue with the 26th China International Optoelectronic Exposition (CIOE), the exhibition covers an area of 300,000 square meters. The two exhibitions will attract more than 180,000 professional visitors and over 4,000 exhibitors, deeply integrating the resources of the two industries and bringing new cross-border cooperation opportunities for exhibitors. High-spec summit support: During the exhibition, the IC Innovation Alliance will host two benchmark events — the China IC Innovation and Development Everest Forum (inviting 100 academicians, experts and enterprise leaders to discuss strategic directions such as third-generation semiconductors and Chiplet advanced packaging) and the 27th IC Manufacturing Annual Conference and Supply Chain Innovation and Development Conference (setting up more than 10 technical sub-forums and attracting over 3,000 industrial chain decision-makers), comprehensively interpreting industrial trends and empowering independent and controllable development. II. Zhongke Tongzhi: Breaking Foreign Monopoly, Leading the Innovation of Domestic Packaging Equipment As a top domestic manufacturer of key semiconductor packaging equipment, Zhongke Tongzhi has always taken technological innovation as the core and continuously broken foreign technical barriers since settling in the Taixing High-tech Zone: Core technological breakthroughs: Independently developed the first domestic mounter realizing fully automatic high-speed placement of 01005 packaging components, and is also the only domestic manufacturer to realize submicron-level high-precision mounters, completely breaking the foreign monopoly in the field of high-end packaging equipment. Dual success in patents and market: By November 2024, the company has applied for nearly 100 patents, and its technical strength has been highly recognized by the industry; products are exported to more than a dozen countries and regions including Russia, the United States and Germany. The invoiced sales reached nearly 50 million RMB in the first half of 2024, and the annual volume is expected to exceed 100 million RMB, with the market competitiveness rising continuously. Exhibition highlights preview: At booth 14L29, Zhongke Tongzhi will focus on displaying core equipment such as high-precision mounters, intuitively presenting its technical advantages in the field of semiconductor packaging. It will provide efficient and reliable domestic equipment solutions for upstream and downstream enterprises in the industrial chain, helping enterprises reduce costs and increase efficiency, and accelerate the process of domestic substitution.