Zhongke Tongzhi Appears at 2024 IC Packaging Technology Exhibition

From November 6 to 8, 2024, the highly anticipated IC Packaging Technology Exhibition was grandly held at Shenzhen Convention and Exhibition Center. This exhibition gathered numerous elite enterprises in the semiconductor industry at home and abroad to jointly display the latest technological achievements and industry trends. Beijing Zhongke Tongzhi Technology Co., Ltd. (hereinafter referred to as "Zhongke Tongzhi"), as an outstanding player in the field of semiconductor packaging equipment, was also invited to attend this grand event.Mr. Wen, Director of Sales, personally led the team, including sales managers, to appear at the exhibition. They not only displayed a series of independently developed semiconductor equipment of the company, but also conducted in-depth exchanges and discussions with exhibitors, industry experts and potential customers from all over the country.Zhongke Tongzhi is a high-tech enterprise specializing in the R&D, production and sales of semiconductor equipment. Its product range covers multiple fields such as silver sintering equipment, flip chip eutectic mounters, submicron-level mounters, high-precision die bonders, vacuum eutectic furnaces, and vacuum reflow soldering. Especially in the packaging of silicon carbide power chips, Zhongke Tongzhi has unique technologies and mature processes.During the exhibition, Zhongke Tongzhi focused on displaying its advanced equipment developed for automotive-grade silicon carbide MOSFET, high-power IGBT and other fields, including nano-silver sintering printers, nano-silver mounters, nano-silver positive pressure sintering furnaces and vacuum sintering furnaces. These equipment not only feature high precision and high efficiency, but also can meet the stringent requirements for reliability and stability in automotive-grade and high-power applications.As one of the leading enterprises in the domestic semiconductor packaging equipment industry, Zhongke Tongzhi has accumulated rich experience and unique insights in the long-term process of providing professional equipment and process services for domestic and foreign electronic manufacturers. Facing the trend of independent innovation in the domestic semiconductor industry, Zhongke Tongzhi has actively responded and taken initiatives, independently developing and mass-producing a series of advanced equipment for SIC device packaging.At present, Zhongke Tongzhi's products have been successfully applied in many fields such as chip lead frame welding, LED bare chip eutectic welding, mass production of IGBT and IPM. In high-reliability welding applications such as preformed solder sheet process sintering, MEMS, deep ultraviolet UVC eutectic, high-power lasers and chip packages, Zhongke Tongzhi's equipment has successfully replaced imported equipment with its excellent performance and stability, and is mass-supplied to major domestic semiconductor enterprises.This participation not only demonstrated Zhongke Tongzhi's latest achievements and technical strength in the field of semiconductor packaging equipment, but also built a good platform for the company's exchanges and cooperation with domestic and foreign counterparts. In the future, Zhongke Tongzhi will continue to uphold the enterprise spirit of "Innovation, Pragmatism and Efficiency", continuously improve its technical level and product quality, and provide more high-quality and efficient semiconductor packaging equipment and process services for domestic and foreign customers.