Zhongke Tongzhi Semiconductor Approved to Establish Taizhou Engineering Technology Research Center, Focusing on Tackling Key Technologies of Special Chip Packaging Equipment

Taizhou, Jiangsu — Recently, in accordance with the official notification from the Taizhou Bureau of Science and Technology, Zhongke Tongzhi Semiconductor (Jiangsu) Co., Ltd. (hereinafter referred to as “Zhongke Tongzhi Semiconductor”), relying on its outstanding R&D capabilities and profound technical accumulation in the field of high-end semiconductor equipment, has been approved to establish the “Taizhou Engineering Technology Research Center for Special Chip Packaging Equipment”. The successful approval of this municipal-level engineering technology research center is a high recognition from the government authorities for Zhongke Tongzhi Semiconductor in terms of technological innovation, intellectual property layout and industrialization capabilities. It marks that the company has officially become a key part of Taizhou’s modern industrial technological innovation system, and will play a core role in promoting the strengthening and supplementing of the regional semiconductor industry chain. It is reported that the center will focus precisely on the cutting-edge core field of “R&D of special chip packaging equipment and research of related processes”. In the post-Moore era, advanced packaging has become a key path to continue the improvement of chip performance, and special packaging equipment is the cornerstone for realizing advanced processes such as heterogeneous integration and wafer-level packaging. Relying on this center, Zhongke Tongzhi Semiconductor will systematically carry out technical research on key equipment, independent R&D of core components and in-depth research on precision manufacturing processes, aiming to break through a number of “bottleneck” technical obstacles restricting the development of my country’s semiconductor packaging and testing industry. This approval is not accidental, but based on Zhongke Tongzhi Semiconductor’s solid foundation of independent innovation. Up to now, the company has accumulated 88 authorized patents, including 20 core invention patents with high technical barriers, forming a complete intellectual property moat. These achievements provide strong technical support and first-mover advantages for the construction and future operation of the engineering technology research center. The person in charge of Zhongke Tongzhi Semiconductor said: “The approval to establish the municipal-level engineering technology research center is an authoritative recognition of our long-term adherence to the independent R&D strategy, and also entrusts us with the major responsibility of leading the technological progress of the industry. We will strictly follow the construction requirements, integrate superior resources, increase R&D investment, deepen the integration of industry, university, research and application, and strive to build the center into a leading source of innovation for special packaging technology in China. Our goal is not only to launch high-end domestic equipment with international competitiveness, but also to contribute solid “Tongzhi strength” to improving the independent controllability and overall resilience of my country’s semiconductor industry chain.” In the future, the construction and operation of the Taizhou Engineering Technology Research Center for Special Chip Packaging Equipment will significantly enhance the core competitiveness of Zhongke Tongzhi Semiconductor, accelerate the industrial application of scientific and technological achievements, and inject new strong momentum into the high-quality development of the semiconductor industry cluster in Taizhou and even the Yangtze River Delta region. About Zhongke Tongzhi Semiconductor (Jiangsu) Co., Ltd.: Zhongke Tongzhi Semiconductor (Jiangsu) Co., Ltd. is a national high-tech enterprise focusing on the R&D, production and sales of high-end semiconductor equipment. The company takes technological innovation as its foundation, focuses on the field of chip packaging and testing, and is committed to providing customers with high-performance and high-precision core equipment and solutions. The company has a strong independent R&D team and a complete intellectual property system, with a total of 88 authorized patents (including 20 invention patents), driving industrial development with technological strength.