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    High Vacuum Eutectic Oven-HV3-3

    High Vacuum Eutectic Oven-HV3-3
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    • Characteristic：

                                               

      1. Soldering area300mm*300mm
      2. Temperature rangeMax 500℃
      3. Vacuum10-5Pa, 10-6Pa is optional
      4. Temperature uniformity≤±2%
      5. Heating rate≤120℃/Min
      6. Cooling rate≤60-120℃/Min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight400kg
      10. Size900*1100*1300 mm
      11. Power supply220V 25-60A
      High Vacuum Eutectic Oven-HV3-3

    •                                          

      1. Soldering area300mm*300mm
      2. Temperature rangeMax 500℃
      3. Vacuum10-5Pa, 10-6Pa is optional
      4. Temperature uniformity≤±2%
      5. Heating rate≤120℃/Min
      6. Cooling rate≤60-120℃/Min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight400kg
      10. Size900*1100*1300 mm
      11. Power supply220V 25-60A
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