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    Bumping Reflow Oven-BRO300
    • Bumping Reflow Oven-BRO300

    Bumping Reflow Oven-BRO300

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    Bumping Reflow OvenBRO300 
    1. Wafer size8inch/12inch
    2. Temperature rangeMax 450 °C
    3. Vacuum
    4. Temperature uniformity土1%
    5. Loadlock zone1
    6. Heating zone3
    7. Cooling zone2
    8. Cooling wayWater cooling
    9. Heating plate material
    10. Weight
    11. Size
    12. Power supply380V 50HZ
    常见问题1 2 3
    • Characteristic：

       

      Bumping Reflow OvenBRO300 
      1. Wafer size8inch/12inch
      2. Temperature rangeMax 450 °C
      3. Vacuum
      4. Temperature uniformity土1%
      5. Loadlock zone1
      6. Heating zone3
      7. Cooling zone2
      8. Cooling wayWater cooling
      9. Heating plate material
      10. Weight
      11. Size
      12. Power supply380V 50HZ
      Bumping Reflow Oven-BRO300

    •  

      Bumping Reflow OvenBRO300 
      1. Wafer size8inch/12inch
      2. Temperature rangeMax 450 °C
      3. Vacuum
      4. Temperature uniformity土1%
      5. Loadlock zone1
      6. Heating zone3
      7. Cooling zone2
      8. Cooling wayWater cooling
      9. Heating plate material
      10. Weight
      11. Size
      12. Power supply380V 50HZ
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