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    TS series Vacuum Reflow Oven -TS210

    TS series Vacuum Reflow Oven -TS210
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    • Characteristic：
      Desktop Vacuum Soldering Oven
      		TS210
      1. Soldering area
      		210mm×210mm
      2. Temperature range
      		Max 450℃
      3. Vacuum
      		≤1Pa
      4. Temperature uniformity
      		≤± 2%
      5. Heating rate
      		60-120K/min
      6. Cooling rate
      		60-120K/min
      7. Cooling way
      		Nitrogen cooling
      8. Heating plate material
      		Alloy heating plate
      9. Weight
      10. Size:
      11. Power supply
      		240KG
      900*800*780mm 240KG
      220V 25A
      TS series Vacuum Reflow Oven -TS210

    •                                          

      1. Soldering area210mm×210mm
      2. Temperature rangeMax 450℃
      3. Vacuum≤1Pa with mechnical pump, 10-3Pa with molecular pump
      4. Temperature uniformity≤± 2%
      5. Heating rate60-120K/min
      6. Cooling rate60-120K/min
      7. Cooling wayNitrogen cooling
      8. Heating plate materialAlloy heating plate
      9. Weight240KG
      10. Size:900*800*780mm 240KG
      11. Power supply220V 25A
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