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    TS series Vacuum Reflow Oven TS110

    TS series Vacuum Reflow Oven TS110
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    • Characteristic：
      Desktop Vacuum Soldering Oven
      		TS110
      1. Soldering area
      		110mm×110mm
      2. Temperature range
      		Max 400℃
      3. Vacuum
      		≤5Pa
      4. Temperature uniformity
      		≤± 2%
      5. Heating rate
      		≤120℃/Min
      6. Cooling rate
      		≤60-120℃/Min
      7. Cooling way
      		Water cooling + nitrogen cooling
      8. Heating plate material
      		Silicon carbide coated Graphite plate
      9. Weight
      10. Size:
      11. Power supply
      		44KG
      290x200x650mm(Main body）
      220V 50Hz

      TS series Vacuum Reflow Oven TS110

    •                                          

      1. Soldering area110mm×110mm
      2. Temperature rangeMax 400℃
      3. Vacuum≤5Pa with mechnical pump, 10-3Pa with molecular pump
      4. Temperature uniformity≤± 2%
      5. Heating rate≤120℃/Min
      6. Cooling rate≤60-120℃/Min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight44KG
      10. Size:290x200x650mm(Main body）
      11. Power supply220V 50Hz
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