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Research, development, production and sales of SMT production equipment and consumables

                                             

    1.Max substrate size240mmx350mm
    2.Min substrate size50mmx50mm
    3.Printing speed30000cph
    4.XY axis precision±0.001mm
    5.Repeat precision+0.015mm
    6.Pad sizeMinimum 0201 (with optional 01005) or more components and the size of the IC (pin spacing of less than 0.4mm iC, ball diameter less than 0.5mm of BGA, with optional)
    7.Min diameter of solder paste0.25mm
    8.Compressed air0.6Mpa ,Gas Flow≥50L/M
    9.Power380V,50Hz,4Kw
    10.Weight750kg
    11.Size168x78x144cm
    常见问题1 2 3
    • Characteristic:

                                               

      1.Max substrate size240mmx350mm
      2.Min substrate size50mmx50mm
      3.Printing speed30000cph
      4.XY axis precision±0.001mm
      5.Repeat precision+0.015mm
      6.Pad sizeMinimum 0201 (with optional 01005) or more components and the size of the IC (pin spacing of less than 0.4mm iC, ball diameter less than 0.5mm of BGA, with optional)
      7.Min diameter of solder paste0.25mm
      8.Compressed air0.6Mpa ,Gas Flow≥50L/M
      9.Power380V,50Hz,4Kw
      10.Weight750kg
      11.Size168x78x144cm
      Solder Paste Jet printer	P1
    •                                          

      1.Max substrate size240mmx350mm
      2.Min substrate size50mmx50mm
      3.Printing speed30000cph
      4.XY axis precision±0.001mm
      5.Repeat precision+0.015mm
      6.Pad sizeMinimum 0201 (with optional 01005) or more components and the size of the IC (pin spacing of less than 0.4mm iC, ball diameter less than 0.5mm of BGA, with optional)
      7.Min diameter of solder paste0.25mm
      8.Compressed air0.6Mpa ,Gas Flow≥50L/M
      9.Power380V,50Hz,4Kw
      10.Weight750kg
      11.Size168x78x144cm
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