| 1.Max substrate size | 240mmx350mm |
| 2.Min substrate size | 50mmx50mm |
| 3.Printing speed | 30000cph |
| 4.XY axis precision | ±0.001mm |
| 5.Repeat precision | +0.015mm |
| 6.Pad size | Minimum 0201 (with optional 01005) or more components and the size of the IC (pin spacing of less than 0.4mm iC, ball diameter less than 0.5mm of BGA, with optional) |
| 7.Min diameter of solder paste | 0.25mm |
| 8.Compressed air | 0.6Mpa ,Gas Flow≥50L/M |
| 9.Power | 380V,50Hz,4Kw |
| 10.Weight | 750kg |
| 11.Size | 168x78x144cm |
| 1.Max substrate size | 240mmx350mm |
| 2.Min substrate size | 50mmx50mm |
| 3.Printing speed | 30000cph |
| 4.XY axis precision | ±0.001mm |
| 5.Repeat precision | +0.015mm |
| 6.Pad size | Minimum 0201 (with optional 01005) or more components and the size of the IC (pin spacing of less than 0.4mm iC, ball diameter less than 0.5mm of BGA, with optional) |
| 7.Min diameter of solder paste | 0.25mm |
| 8.Compressed air | 0.6Mpa ,Gas Flow≥50L/M |
| 9.Power | 380V,50Hz,4Kw |
| 10.Weight | 750kg |
| 11.Size | 168x78x144cm |