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Research, development, production and sales of SMT production equipment and consumables

                                             

    1.Max substrate size350mmx400mm
    2.Min substrate size50mmx50mm
    3.Printing speed40000cph
    4.XY axis precision±0.001mm
    5.Repeat precision+0.015mm
    6.Pad sizeMinimum 0201 (with optional 01005) or more components and the size of the IC (pin spacing of less than 0.4mm iC, ball diameter less than 0.5mm of BGA, with optional)
    7.Min diameter of solder paste0.25mm(0.15mm Paste, the nozzle to be customized)
    8.Compressed air0.6Mpa ,Gas Flow≥50L/M
    9.Power380V,50Hz,5Kw
    10.Weight850kg
    11.Size120x159x144cm
    常见问题1 2 3
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      1.Max substrate size350mmx400mm
      2.Min substrate size50mmx50mm
      3.Printing speed40000cph
      4.XY axis precision±0.001mm
      5.Repeat precision+0.015mm
      6.Pad sizeMinimum 0201 (with optional 01005) or more components and the size of the IC (pin spacing of less than 0.4mm iC, ball diameter less than 0.5mm of BGA, with optional)
      7.Min diameter of solder paste0.25mm(0.15mm Paste, the nozzle to be customized)
      8.Compressed air0.6Mpa ,Gas Flow≥50L/M
      9.Power380V,50Hz,5Kw
      10.Weight850kg
      11.Size120x159x144cm
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