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    Getter Thermal Activation High Vacuum Sealing and Welding Furnace — VH2Plus
    • Getter Thermal Activation High Vacuum Sealing and Welding Furnace — VH2Plus

    Getter Thermal Activation High Vacuum Sealing and Welding Furnace — VH2Plus

    The VH series high vacuum sealing and welding furnace is a professional piece of equipment dedicated to Getter thermal activation. Adopting top and bottom infrared heating and equipped with a controllable process atmosphere system for nitrogen and formic acid, it is capable of operating under both high vacuum and protective atmosphere conditions.

    The VH series high vacuum sealing and welding furnace is a professional piece of equipment dedicated to Getter thermal activation. Adopting top and bottom infrared heating and equipped with a controllable process atmosphere system for nitrogen and formic acid, it is capable of operating under both high vacuum and protective atmosphere conditions. The furnace can simultaneously complete high-temperature activation of getters and low-temperature welding of chips. With high temperature control accuracy and stable process performance, it achieves ultra-low void rate and superior air tightness for welded devices. The equipment shell adopts a water cooling design to ensure reliable long-term operation. Core Process Advantages The furnace enables thermal insulation protection for 130℃ low-temperature solder while conducting 350℃ high-temperature Getter thermal activation, realizing the integration of 350℃ Getter high-temperature activation and 180℃ low-temperature chip welding in a single equipment chamber. Key Performance Indicators Ultimate vacuum degree: Up to 10⁻⁵Pa Temperature control accuracy: High-precision temperature control with stable process execution Atmosphere control: Controllable nitrogen/formic acid atmosphere, supporting both vacuum and atmosphere operation modes Applicable Scenarios & Production Capacity Applicable devices: High vacuum packaging and welding of MEMS devices, PGA ceramic packaged infrared chips (package size range: 5×5~45×45mm) Production capacity: Meets the mass packaging production requirements of ceramic packaged infrared chips and MEMS chips Intelligent Process & Error Prevention Functions Material error prevention: Connectable to the MES system for automatic ID reading to avoid material misloading. Core process foolproofing: Automatically compares the device's key parameters with the process parameters stored on the MES server upon startup; welding can only be performed if the parameters match. Customizable real-time parameter comparison (at set time intervals) during the process, with automatic alarm and manual intervention prompt if parameters exceed the threshold. Data acquisition: Full-process real-time data acquisition of key process parameters for traceability and analysis. MES system integration: Seamless connection with the MES system to realize intelligent data interaction and process management. Standard Configuration Getter thermal activation vacuum sealing and welding furnace main unit × 1 set Industrial water chiller × 1 unit Vacuum dry pump × 1 unit Turbomolecular pump × 1 unit Optional Configuration Top heating module (suitable for welding products with high-size jigs) Ion pump

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    Thermal Separation Vacuum Eutectic Furnace — V3D

    Soldering Temperature Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height 100 mm

    Thermal Separation Vacuum Eutectic Furnace — V4D

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height 100 mm

    High-Vacuum Eutectic Furnace — HV3-3

    Soldering Temperature Maximum actual soldering temperature of the HV3-3 Vacuum Eutectic Furnace ≥ 500℃ Vacuum Level Ultimate vacuum ≤ 10⁻⁵ Pa; Working vacuum: 10⁻⁵ Pa Effective Soldering Area ≥ 300 mm × 300 mm

    High Purity Vacuum Eutectic Furnace — SHV-33

    Basic Technical Parameters Soldering Temperature: Maximum actual soldering temperature ≥ 500℃ Vacuum Level: Ultimate vacuum ≤ 10 Pa; Working vacuum 10 Pa Effective Soldering Area: ≥ 260mm×240mm Furnace Chamber Height: ≥ 100mm (customizable for special heights) Temperature Uniformity: ≤ 1% within the effective soldering area Heating Rate: Maximum heating rate of the platform ≤ 120℃/min (controllable) Cooling Rate: Maximum 60-120℃/min (cooling slope for 100℃ drop at no-load maximum temperature, controllable via process)

    High-Cleanliness Vacuum Eutectic Furnace — SHV-30

    Soldering Temperature Maximum actual soldering temperature of the high-cleanliness vacuum eutectic furnace ≥ 500℃
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    Basic Technical Parameters Sol...
    • The VH series high vacuum sealing and welding furnace is a professional piece of equipment dedicated to Getter thermal activation. Adopting top and bottom infrared heating and equipped with a controllable process atmosphere system for nitrogen and formic acid, it is capable of operating under both high vacuum and protective atmosphere conditions. The furnace can simultaneously complete high-temperature activation of getters and low-temperature welding of chips. With high temperature control accuracy and stable process performance, it achieves ultra-low void rate and superior air tightness for welded devices. The equipment shell adopts a water cooling design to ensure reliable long-term operation. Core Process Advantages The furnace enables thermal insulation protection for 130℃ low-temperature solder while conducting 350℃ high-temperature Getter thermal activation, realizing the integration of 350℃ Getter high-temperature activation and 180℃ low-temperature chip welding in a single equipment chamber. Key Performance Indicators Ultimate vacuum degree: Up to 10⁻⁵Pa Temperature control accuracy: High-precision temperature control with stable process execution Atmosphere control: Controllable nitrogen/formic acid atmosphere, supporting both vacuum and atmosphere operation modes Applicable Scenarios & Production Capacity Applicable devices: High vacuum packaging and welding of MEMS devices, PGA ceramic packaged infrared chips (package size range: 5×5~45×45mm) Production capacity: Meets the mass packaging production requirements of ceramic packaged infrared chips and MEMS chips Intelligent Process & Error Prevention Functions Material error prevention: Connectable to the MES system for automatic ID reading to avoid material misloading. Core process foolproofing: Automatically compares the device's key parameters with the process parameters stored on the MES server upon startup; welding can only be performed if the parameters match. Customizable real-time parameter comparison (at set time intervals) during the process, with automatic alarm and manual intervention prompt if parameters exceed the threshold. Data acquisition: Full-process real-time data acquisition of key process parameters for traceability and analysis. MES system integration: Seamless connection with the MES system to realize intelligent data interaction and process management. Standard Configuration Getter thermal activation vacuum sealing and welding furnace main unit × 1 set Industrial water chiller × 1 unit Vacuum dry pump × 1 unit Turbomolecular pump × 1 unit Optional Configuration Top heating module (suitable for welding products with high-size jigs) Ion pump

    Thermal Separation Vacuum Eutectic Furnace — V3D

    Soldering Temperature Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height 100 mm

    Thermal Separation Vacuum Eutectic Furnace — V4D

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height 100 mm

    High-Vacuum Eutectic Furnace — HV3-3

    Soldering Temperature Maximum actual soldering temperature of the HV3-3 Vacuum Eutectic Furnace ≥ 500℃ Vacuum Level Ultimate vacuum ≤ 10⁻⁵ Pa; Working vacuum: 10⁻⁵ Pa Effective Soldering Area ≥ 300 mm × 300 mm

    High Purity Vacuum Eutectic Furnace — SHV-33

    Basic Technical Parameters Soldering Temperature: Maximum actual soldering temperature ≥ 500℃ Vacuum Level: Ultimate vacuum ≤ 10 Pa; Working vacuum 10 Pa Effective Soldering Area: ≥ 260mm×240mm Furnace Chamber Height: ≥ 100mm (customizable for special heights) Temperature Uniformity: ≤ 1% within the effective soldering area Heating Rate: Maximum heating rate of the platform ≤ 120℃/min (controllable) Cooling Rate: Maximum 60-120℃/min (cooling slope for 100℃ drop at no-load maximum temperature, controllable via process)

    High-Cleanliness Vacuum Eutectic Furnace — SHV-30

    Soldering Temperature Maximum actual soldering temperature of the high-cleanliness vacuum eutectic furnace ≥ 500℃
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