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    Getter High Vacuum Eutectic furnaces-VH4
    • Getter High Vacuum Eutectic furnaces-VH4

    Getter High Vacuum Eutectic furnaces-VH4

     

    1. Soldering area140mm×140mm×4
    2. Temperature range450℃
    3. Vacuum10-5 Pa
    4. Temperature uniformity≤±5℃
    5. Heating rate1.5℃/s 
    6. Cooling rate
    7. Cooling wayWater cooling + nitrogen cooling
    8. Heating plate materialSilicon carbide coated Graphite plate
    9. Weight
    10. Size1520x1280x1740mm
    11. Power supply380V 50Hz
    常见问题1 2 3
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    Thermal Separation Vacuum Eutectic Furnace — V3D

    Soldering Temperature Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height 100 mm

    Thermal Separation Vacuum Eutectic Furnace — V4D

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height 100 mm

    High-Vacuum Eutectic Furnace — HV3-3

    Soldering Temperature Maximum actual soldering temperature of the HV3-3 Vacuum Eutectic Furnace ≥ 500℃ Vacuum Level Ultimate vacuum ≤ 10⁻⁵ Pa; Working vacuum: 10⁻⁵ Pa Effective Soldering Area ≥ 300 mm × 300 mm

    High Purity Vacuum Eutectic Furnace — SHV-33

    Basic Technical Parameters Soldering Temperature: Maximum actual soldering temperature ≥ 500℃ Vacuum Level: Ultimate vacuum ≤ 10 Pa; Working vacuum 10 Pa Effective Soldering Area: ≥ 260mm×240mm Furnace Chamber Height: ≥ 100mm (customizable for special heights) Temperature Uniformity: ≤ 1% within the effective soldering area Heating Rate: Maximum heating rate of the platform ≤ 120℃/min (controllable) Cooling Rate: Maximum 60-120℃/min (cooling slope for 100℃ drop at no-load maximum temperature, controllable via process)

    High-Cleanliness Vacuum Eutectic Furnace — SHV-30

    Soldering Temperature Maximum actual soldering temperature of the high-cleanliness vacuum eutectic furnace ≥ 500℃
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    Basic Technical Parameters Sol...
    • Characteristic:

       

      1. Soldering area140mm×140mm×4
      2. Temperature range450℃
      3. Vacuum10-5 Pa
      4. Temperature uniformity≤±5℃
      5. Heating rate1.5℃/s 
      6. Cooling rate
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight
      10. Size1520x1280x1740mm
      11. Power supply380V 50Hz
      Getter High Vacuum Eutectic furnaces-VH4
    •  

      1. Soldering area140mm×140mm×4
      2. Temperature range450℃
      3. Vacuum10-5 Pa
      4. Temperature uniformity≤±5℃
      5. Heating rate1.5℃/s 
      6. Cooling rate
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight
      10. Size1520x1280x1740mm
      11. Power supply380V 50Hz

    Thermal Separation Vacuum Eutectic Furnace — V3D

    Soldering Temperature Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height 100 mm

    Thermal Separation Vacuum Eutectic Furnace — V4D

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height 100 mm

    High-Vacuum Eutectic Furnace — HV3-3

    Soldering Temperature Maximum actual soldering temperature of the HV3-3 Vacuum Eutectic Furnace ≥ 500℃ Vacuum Level Ultimate vacuum ≤ 10⁻⁵ Pa; Working vacuum: 10⁻⁵ Pa Effective Soldering Area ≥ 300 mm × 300 mm

    High Purity Vacuum Eutectic Furnace — SHV-33

    Basic Technical Parameters Soldering Temperature: Maximum actual soldering temperature ≥ 500℃ Vacuum Level: Ultimate vacuum ≤ 10 Pa; Working vacuum 10 Pa Effective Soldering Area: ≥ 260mm×240mm Furnace Chamber Height: ≥ 100mm (customizable for special heights) Temperature Uniformity: ≤ 1% within the effective soldering area Heating Rate: Maximum heating rate of the platform ≤ 120℃/min (controllable) Cooling Rate: Maximum 60-120℃/min (cooling slope for 100℃ drop at no-load maximum temperature, controllable via process)

    High-Cleanliness Vacuum Eutectic Furnace — SHV-30

    Soldering Temperature Maximum actual soldering temperature of the high-cleanliness vacuum eutectic furnace ≥ 500℃
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