Basic Technical Parameters Soldering Temperature: Maximum actual soldering temperature ≥ 500℃ Vacuum Level: Ultimate vacuum ≤ 10 Pa; Working vacuum 10 Pa Effective Soldering Area: ≥ 260mm×240mm Furnace Chamber Height: ≥ 100mm (customizable for special heights) Temperature Uniformity: ≤ 1% within the effective soldering area Heating Rate: Maximum heating rate of the platform ≤ 120℃/min (controllable) Cooling Rate: Maximum 60-120℃/min (cooling slope for 100℃ drop at no-load maximum temperature, controllable via process) Heating & Cooling System The furnace adopts bottom + top infrared radiation heating; the hot plate features a semiconductor-grade silicon carbide (SiC) platform, which resists deformation after long-term use and has high thermal conductivity for more uniform surface temperature. The optional top heating system not only improves heating efficiency but also enhances platform temperature uniformity, ensuring soldering consistency and quality. The heating platform adopts a combined air cooling + water cooling mode to achieve rapid cooling of the hot plate and increase the cooling rate. It avoids poor device sintering caused by excessive temperature difference during cooling, and the cooling rate is controllable to meet slow cooling requirements as well. Solder Compatibility Suitable for soldering materials with a melting point ≤ 500℃, including preformed solder foils (enabling flux-free eutectic soldering) such as In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37, Sn62Pb36Ag2, as well as various solder pastes. It also supports the curing of materials below 500℃. Soldering Quality Through extensive customer verification, the void ratio can be controlled within 0-3% for soft solder soldering. Temperature Control & Measurement System Adopts professional temperature control technology with a temperature control accuracy of ±1℃. The temperature curve can be set with up to 40 segments, and configured with 3 sets of PID settings (6 sets optional) for more precise temperature control, ensuring soldering consistency and reliability. PID control with advanced regulation function compensates for the hysteresis of temperature control, improving control accuracy and stability. The furnace chamber is standard equipped with 4 sets of temperature measurement thermocouples, which can real-time feed back the temperature at any position in the chamber during operation. The temperature curves are displayed in real time on the control software, ensuring precise temperature control in the soldering area and supporting the formulation of optimal process curves. Furnace Chamber Atmosphere System The furnace can be filled with nitrogen and other inert gases for auxiliary soldering, and also supports formic acid reduction atmosphere process. The process atmosphere is precisely controlled by time or MFC mass flow meter to ensure the consistency of each set process execution. The equipment is equipped with a closed waste gas exhaust channel and filtration system for safe gas treatment and emission, enabling flux-free soldering process. Chamber Structure & Operation Adopts a closed chamber structure for long-term operational reliability; the upper cover closure will not cause device displacement, avoiding soldering quality defects due to device vibration. The single-chamber design meets both heating and cooling process requirements. The upper cover is equipped with a viewing window, allowing observation of the device sintering process via CCD or microscope. The upper cover is automatically lifted and lowered; all operations are software-controlled automatically except for manual loading and unloading of workpieces. Software Control System Based on the Windows operating system with a simple and user-friendly operation interface. Realizes process programming via setting process conditions such as temperature, time, pressure and vacuum; the software automatically controls the entire process flow. Supports an unlimited number of process actions in curve programming to meet complex process requirements. Compatible with various soldering process curves, which can be set, modified, saved and recalled according to different processes. Built-in analysis function for process curves to identify key parameters such as heating, constant temperature and cooling stages. Automatically records soldering processes, temperature control and measurement curves in real time, ensuring process traceability of devices; data is automatically saved in the corresponding directory by working time. Standard Configuration Main unit × 1 Industrial-grade control computer × 1 Vacuum sintering furnace control software system × 1 set Nitrogen atmosphere system & formic acid atmosphere system MFC mass flow meter × 1 Vacuum pump (mechanical dry pump + molecular pump) Silicon carbide coated heating platform Optional Configuration Top heating system Digital nitrogen-hydrogen mixed atmosphere system Positive pressure module CCD vision system / Microscope Nitrogen-hydrogen mixed gas atmosphere
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