Wafer Formic Acid Reflow Oven — BR0300

A. Each zone is heated simultaneously from top and bottom for more uniform temperature distribution. B. Advanced formic acid reflow process is adopted to effectively remove oxides and contaminants. C. Each zone is equipped with independent vacuum control; the formic acid supply volume and oxygen content of each zone can be programmably controlled, enabling better control over reflow performance. D. The process programming is simplified, facilitating the introduction of various manufacturing processes. E. High compatibility: the whole machine is compatible with 8-inch and 12-inch standard wafers as well as warped wafers. F. The product is configured with 4 sets of independent heating chambers to meet the requirements of uniform temperature rise and fall of wafers. G. High productivity: the hourly output can reach 40–120 pieces. H. Easy maintenance and servicing with a maintenance interval of more than 3 weeks. I. Programmable parameters: temperature, heating rate, cooling rate, movement speed, formic acid concentration, vacuum pumping speed, and vacuum adsorption.