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    Inline Wafer Vacuum Formic Acid Oven — WRO1300
    • Inline Wafer Vacuum Formic Acid Oven — WRO1300

    Inline Wafer Vacuum Formic Acid Oven — WRO1300

    The WRO1300 is an inline wafer vacuum formic acid oven characterized by high throughput, low energy consumption, low nitrogen usage, and mobility. It is a vacuum soldering and packaging furnace with 13 temperature-controlled stations, specifically designed for chip soldering processes.
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    The WRO1300 is an inline wafer vacuum formic acid oven characterized by high throughput, low energy consumption, low nitrogen usage, and mobility. It is a vacuum soldering and packaging furnace with 13 temperature-controlled stations, specifically designed for chip soldering processes. Core Performance & Basic Parameters High Throughput: Features a 13-station inline conveyor system for high production efficiency. Power: 65 kW Nitrogen Consumption: 40 m³/h Mobility: Equipped with universal wheels for easy relocation; no additional alignment or calibration costs required. Equipment Weight: 5500 kg Solder Compatibility: Supports various solders up to 450℃, including SAC305, Sn63Pb37, Sn90Sb, In52Sn48, and other solder pastes. Key Technical Advantages Soldering Void Ratio: Total void ratio < 1%, single void ratio < 2%. These values are based on comprehensive customer testing and may vary with different materials and process conditions. Multi-Atmosphere Support: Compatible with nitrogen, formic acid, and other soldering atmospheres. User-Friendly Control System: The vacuum reflow oven is equipped with a modular software control system, featuring an intuitive and easy-to-operate interface. Complete Equipment Configuration Temperature Control System Temperature Measurement System Vacuum System Industrial Computer System Upper & Lower Heating System Robotic Feeding System Water Cooling System Nitrogen & Formic Acid Control System Nitrogen & Formic Acid Recovery System + Flux Recovery System Electrical Control System




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    Wafer Formic Acid Reflow Oven — BR0300

    Wafer Formic Acid Reflow Oven — BR0300

    A. Each zone is heated simultaneously from top and bottom for more uniform temperature distribution. B. Advanced formic acid reflow process is adopted to effectively remove oxides and contaminants.
    High-Cleanliness Vacuum Eutectic Furnace — SHV-30

    High-Cleanliness Vacuum Eutectic Furnace — SHV-30

    Soldering Temperature Maximum actual soldering temperature of the high-cleanliness vacuum eutectic furnace ≥ 500℃
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    High Purity Vacuum Eutectic Furnace — SHV-33

    Basic Technical Parameters Soldering Temperature: Maximum actual soldering temperature ≥ 500℃ Vacuum Level: Ultimate vacuum ≤ 10 Pa; Working vacuum 10 Pa Effective Soldering Area: ≥ 260mm×240mm Furnace Chamber Height: ≥ 100mm (customizable for special heights) Temperature Uniformity: ≤ 1% within the effective soldering area Heating Rate: Maximum heating rate of the platform ≤ 120℃/min (controllable) Cooling Rate: Maximum 60-120℃/min (cooling slope for 100℃ drop at no-load maximum temperature, controllable via process)
    Inline Wafer Vacuum Formic Acid Oven — WRO1300

    Inline Wafer Vacuum Formic Acid Oven — WRO1300

    The WRO1300 is an inline wafer vacuum formic acid oven characterized by high throughput, low energy consumption, low nitrogen usage, and mobility. It is a vacuum soldering and packaging furnace with 13 temperature-controlled stations, specifically designed for chip soldering processes.
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    Inline Wafer Vacuum Formic Acid Oven — WRO1300
    The WRO1300 is an inline wafer...
    • Inline Wafer Vacuum Formic Acid Oven — WRO1300


    • The WRO1300 is an inline wafer vacuum formic acid oven characterized by high throughput, low energy consumption, low nitrogen usage, and mobility. It is a vacuum soldering and packaging furnace with 13 temperature-controlled stations, specifically designed for chip soldering processes. Core Performance & Basic Parameters High Throughput: Features a 13-station inline conveyor system for high production efficiency. Power: 65 kW Nitrogen Consumption: 40 m³/h Mobility: Equipped with universal wheels for easy relocation; no additional alignment or calibration costs required. Equipment Weight: 5500 kg Solder Compatibility: Supports various solders up to 450℃, including SAC305, Sn63Pb37, Sn90Sb, In52Sn48, and other solder pastes. Key Technical Advantages Soldering Void Ratio: Total void ratio < 1%, single void ratio < 2%. These values are based on comprehensive customer testing and may vary with different materials and process conditions. Multi-Atmosphere Support: Compatible with nitrogen, formic acid, and other soldering atmospheres. User-Friendly Control System: The vacuum reflow oven is equipped with a modular software control system, featuring an intuitive and easy-to-operate interface. Complete Equipment Configuration Temperature Control System Temperature Measurement System Vacuum System Industrial Computer System Upper & Lower Heating System Robotic Feeding System Water Cooling System Nitrogen & Formic Acid Control System Nitrogen & Formic Acid Recovery System + Flux Recovery System Electrical Control System




    Wafer Formic Acid Reflow Oven — BR0300

    Wafer Formic Acid Reflow Oven — BR0300

    A. Each zone is heated simultaneously from top and bottom for more uniform temperature distribution. B. Advanced formic acid reflow process is adopted to effectively remove oxides and contaminants.
    High-Cleanliness Vacuum Eutectic Furnace — SHV-30

    High-Cleanliness Vacuum Eutectic Furnace — SHV-30

    Soldering Temperature Maximum actual soldering temperature of the high-cleanliness vacuum eutectic furnace ≥ 500℃
    High Purity Vacuum Eutectic Furnace — SHV-33

    High Purity Vacuum Eutectic Furnace — SHV-33

    Basic Technical Parameters Soldering Temperature: Maximum actual soldering temperature ≥ 500℃ Vacuum Level: Ultimate vacuum ≤ 10 Pa; Working vacuum 10 Pa Effective Soldering Area: ≥ 260mm×240mm Furnace Chamber Height: ≥ 100mm (customizable for special heights) Temperature Uniformity: ≤ 1% within the effective soldering area Heating Rate: Maximum heating rate of the platform ≤ 120℃/min (controllable) Cooling Rate: Maximum 60-120℃/min (cooling slope for 100℃ drop at no-load maximum temperature, controllable via process)
    Inline Wafer Vacuum Formic Acid Oven — WRO1300

    Inline Wafer Vacuum Formic Acid Oven — WRO1300

    The WRO1300 is an inline wafer vacuum formic acid oven characterized by high throughput, low energy consumption, low nitrogen usage, and mobility. It is a vacuum soldering and packaging furnace with 13 temperature-controlled stations, specifically designed for chip soldering processes.
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