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    Inline Vacuum Reflow Soldering Machine — VR-16
    • Inline Vacuum Reflow Soldering Machine — VR-16

    Inline Vacuum Reflow Soldering Machine — VR-16

    Drastically reduce welding bubbles in solder, resulting in a void ratio as low as 1-2%. Enhance the electrical performance of products and the bonding strength of welded joints, effectively improving the reliability and quality of solder joints. Suitable for double-sided PCB welding and mass production, and can be integrated into production lines for continuous operation. The average production cycle is controlled at 30-60 seconds. The vacuum degree, vacuum holding time, deflation time, vacuum pumping rate and other parameters can be freely set. Flux management system: Realize condensing collection, and equip with a pyrolysis system and a flux pre-recovery system in the preheating zone.

    Drastically reduce welding bubbles in solder, with the void ratio as low as 1-2%. Improve the electrical performance of products and the bonding strength of welded joints, effectively enhancing the reliability and quality of solder joints. Applicable for double-sided PCB welding and mass production; can be integrated into production lines for continuous operation. The average production takt time is controlled at 30-60s. Vacuum degree, vacuum holding time, deflation time, vacuum pumping rate and other parameters can be set freely. Flux management system: Realizes condensation collection, and is equipped with a pyrolysis system and a flux pre-recovery system in the preheating zone. Chain speed: 200-2000mm/min; Rail linearity: ≤±1mm for the whole line rail. Number of independently controllable heating zones: No less than 11 hot air convection temperature zones. Maximum temperature of heating zones: 350℃; Temperature control accuracy: ≤±1℃. Total dimensions of heating zones: Length 8880mm, Width 1850mm, Height 1600mm (detachable); Temperature rise rate: 2-4℃/sec. Rotation speed of motors and fans in temperature zones is adjustable with a frequency conversion mode, equipped with 5 frequency converters. Total length of cooling zones: 1840mm; Maximum cooling rate range: 2-8℃/sec. Vacuum pump: Original imported Busch vacuum pump from Germany, with a flow rate of no less than 200 m³/h. Maximum size of boards (including carriers) for vacuum chamber: Single rail, ≤L400mm×W600mm. Nitrogen device: Equipped with a residual oxygen analyzer and a closed-loop residual oxygen control system (including an automatically controlled proportional valve). The equipment is featured with a fault self-diagnosis function. With an exhaust air volume monitoring function. Equipped with an MES module. With a vacuum explosion-proof function and a safety inflation and deflation valve; the equipment is also equipped with a vacuum gauge and a pressure switch for dual negative pressure detection. The equipment is fitted with an 8-channel furnace temperature tester. The equipment can be used as a conventional nitrogen reflow soldering machine when the vacuum function is not activated. Equipped with temperature control and protection devices of more than two levels. Conveying rail: The equipment is equipped with a 4-section conveying rail with a buffer zone to prevent manual misoperation of premature board feeding; Cold start temperature rise time: <30min; Transverse temperature difference: ≤±2℃. Equipped with hardware and software operating systems; the main control computer is of Lenovo brand, with the genuine Chinese professional version of Windows 64-bit operating system. The operating system has no connection records of USB flash drives, mobile phones, etc., and no viruses or backdoor programs; the software supports lifetime free upgrade and maintenance. Adopts reliable occupational health and safety technical measures; safety protection devices are installed for spare parts that may affect safe operation and control. The safety protection devices are matched with the equipment and comply with relevant standards. Capable of welding circuit boards assembled with aluminum heat sinks. Environmentally friendly design with ultra-low power consumption and high heat insulation; the shell temperature does not exceed 40℃. High-efficiency and large-capacity flux recovery device. Adopts integrated oxygen sensor technology to ensure precise control of oxygen content, and can monitor the residual oxygen content in the furnace chamber in real time/continuously. The equipment can also be used as a conventional nitrogen or air reflow soldering furnace.

     

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    • Characteristic:
      Item
      VR-16
      Soldering Area
      400mm × 600mm
      Furnace Chamber Height
      60mm (35mm upper, 25mm lower; other heights optional)
      Heating Method
      Metal Heater + Infrared Heater


      Inline Vacuum Reflow Soldering Machine — VR-16
    • Drastically reduce welding bubbles in solder, with the void ratio as low as 1-2%. Improve the electrical performance of products and the bonding strength of welded joints, effectively enhancing the reliability and quality of solder joints. Applicable for double-sided PCB welding and mass production; can be integrated into production lines for continuous operation. The average production takt time is controlled at 30-60s. Vacuum degree, vacuum holding time, deflation time, vacuum pumping rate and other parameters can be set freely. Flux management system: Realizes condensation collection, and is equipped with a pyrolysis system and a flux pre-recovery system in the preheating zone. Chain speed: 200-2000mm/min; Rail linearity: ≤±1mm for the whole line rail. Number of independently controllable heating zones: No less than 11 hot air convection temperature zones. Maximum temperature of heating zones: 350℃; Temperature control accuracy: ≤±1℃. Total dimensions of heating zones: Length 8880mm, Width 1850mm, Height 1600mm (detachable); Temperature rise rate: 2-4℃/sec. Rotation speed of motors and fans in temperature zones is adjustable with a frequency conversion mode, equipped with 5 frequency converters. Total length of cooling zones: 1840mm; Maximum cooling rate range: 2-8℃/sec. Vacuum pump: Original imported Busch vacuum pump from Germany, with a flow rate of no less than 200 m³/h. Maximum size of boards (including carriers) for vacuum chamber: Single rail, ≤L400mm×W600mm. Nitrogen device: Equipped with a residual oxygen analyzer and a closed-loop residual oxygen control system (including an automatically controlled proportional valve). The equipment is featured with a fault self-diagnosis function. With an exhaust air volume monitoring function. Equipped with an MES module. With a vacuum explosion-proof function and a safety inflation and deflation valve; the equipment is also equipped with a vacuum gauge and a pressure switch for dual negative pressure detection. The equipment is fitted with an 8-channel furnace temperature tester. The equipment can be used as a conventional nitrogen reflow soldering machine when the vacuum function is not activated. Equipped with temperature control and protection devices of more than two levels. Conveying rail: The equipment is equipped with a 4-section conveying rail with a buffer zone to prevent manual misoperation of premature board feeding; Cold start temperature rise time: <30min; Transverse temperature difference: ≤±2℃. Equipped with hardware and software operating systems; the main control computer is of Lenovo brand, with the genuine Chinese professional version of Windows 64-bit operating system. The operating system has no connection records of USB flash drives, mobile phones, etc., and no viruses or backdoor programs; the software supports lifetime free upgrade and maintenance. Adopts reliable occupational health and safety technical measures; safety protection devices are installed for spare parts that may affect safe operation and control. The safety protection devices are matched with the equipment and comply with relevant standards. Capable of welding circuit boards assembled with aluminum heat sinks. Environmentally friendly design with ultra-low power consumption and high heat insulation; the shell temperature does not exceed 40℃. High-efficiency and large-capacity flux recovery device. Adopts integrated oxygen sensor technology to ensure precise control of oxygen content, and can monitor the residual oxygen content in the furnace chamber in real time/continuously. The equipment can also be used as a conventional nitrogen or air reflow soldering furnace.

       

    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.

    Vacuum Positive Pressure Welding and Packaging Furnace — VPO300

    Welding Temperature: The maximum actual welding temperature of the VPO300 vacuum positive pressure sintering furnace is ≥800℃. Vacuum Degree: Ultimate vacuum degree ≤5×10⁻² torr. Positive Pressure Capacity: 0.5Mpa (1Mpa optional). Effective Welding Area: ≥300mm×300mm.

    Formic Acid Reflow Oven — V4DR

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≥ 380 mm × 310 mm

    Formic Acid Reflow Oven — V3DR

    Soldering Temperature Maximum actual soldering temperature of the V3DR Formic Acid Reflow Oven ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.3 Pa; Working vacuum: 5 Pa – 200 Pa Temperature Uniformity ≤ ±1% within the effective soldering area Effective Soldering Area ≤ 300 mm × 300 mm

    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.
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