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    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12
    • Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
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    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s. Vacuum level, vacuum holding time, gas release time, vacuum pumping rate and other parameters can be freely set. Capable of soldering circuit boards equipped with aluminum heat sinks. Environment-friendly design with ultra-low power consumption and high thermal insulation performance, and the shell temperature remains below 40℃. Equipped with a high-efficiency, large-capacity flux recovery device. Adopts integrated oxygen sensor technology to ensure precise control of oxygen content, and enables real-time/continuous monitoring of residual oxygen content in the furnace chamber. The equipment can also be used as a conventional nitrogen or air reflow oven.

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    Inline Vacuum Formic Acid Oven — V8S

    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.
    Vacuum Positive Pressure Welding and Packaging Furnace — VPO300

    Vacuum Positive Pressure Welding and Packaging Furnace — VPO300

    Welding Temperature: The maximum actual welding temperature of the VPO300 vacuum positive pressure sintering furnace is ≥800℃. Vacuum Degree: Ultimate vacuum degree ≤5×10⁻² torr. Positive Pressure Capacity: 0.5Mpa (1Mpa optional). Effective Welding Area: ≥300mm×300mm.
    Formic Acid Reflow Oven — V4DR

    Formic Acid Reflow Oven — V4DR

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≥ 380 mm × 310 mm
    Formic Acid Reflow Oven — V3DR

    Formic Acid Reflow Oven — V3DR

    Soldering Temperature Maximum actual soldering temperature of the V3DR Formic Acid Reflow Oven ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.3 Pa; Working vacuum: 5 Pa – 200 Pa Temperature Uniformity ≤ ±1% within the effective soldering area Effective Soldering Area ≤ 300 mm × 300 mm
    Inline Vacuum Formic Acid Oven — V8S

    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.
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    Inline Vacuum Formic Acid Oven — V8S
    The V8S/V8H Inline Vacuum Sold...
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    Vacuum Positive Pressure Welding and Packaging Furnace — VPO300
    Welding Temperature: The maxim...
    Formic Acid Ref...
    Formic Acid Reflow Oven — V4DR
    Soldering Temperature Maximum ...
    Formic Acid Ref...
    Formic Acid Reflow Oven — V3DR
    Soldering Temperature Maximum ...
    • Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    • Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s. Vacuum level, vacuum holding time, gas release time, vacuum pumping rate and other parameters can be freely set. Capable of soldering circuit boards equipped with aluminum heat sinks. Environment-friendly design with ultra-low power consumption and high thermal insulation performance, and the shell temperature remains below 40℃. Equipped with a high-efficiency, large-capacity flux recovery device. Adopts integrated oxygen sensor technology to ensure precise control of oxygen content, and enables real-time/continuous monitoring of residual oxygen content in the furnace chamber. The equipment can also be used as a conventional nitrogen or air reflow oven.

    Inline Vacuum Formic Acid Oven — V8S

    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.
    Vacuum Positive Pressure Welding and Packaging Furnace — VPO300

    Vacuum Positive Pressure Welding and Packaging Furnace — VPO300

    Welding Temperature: The maximum actual welding temperature of the VPO300 vacuum positive pressure sintering furnace is ≥800℃. Vacuum Degree: Ultimate vacuum degree ≤5×10⁻² torr. Positive Pressure Capacity: 0.5Mpa (1Mpa optional). Effective Welding Area: ≥300mm×300mm.
    Formic Acid Reflow Oven — V4DR

    Formic Acid Reflow Oven — V4DR

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≥ 380 mm × 310 mm
    Formic Acid Reflow Oven — V3DR

    Formic Acid Reflow Oven — V3DR

    Soldering Temperature Maximum actual soldering temperature of the V3DR Formic Acid Reflow Oven ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.3 Pa; Working vacuum: 5 Pa – 200 Pa Temperature Uniformity ≤ ±1% within the effective soldering area Effective Soldering Area ≤ 300 mm × 300 mm
    Inline Vacuum Formic Acid Oven — V8S

    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.
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