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Inline Vacuum Formic Acid Oven — V8S
The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint.
The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.
Vacuum Positive Pressure Welding and Packaging Furnace — VPO300
Welding Temperature: The maximum actual welding temperature of the VPO300 vacuum positive pressure sintering furnace is ≥800℃.
Vacuum Degree: Ultimate vacuum degree ≤5×10⁻² torr.
Positive Pressure Capacity: 0.5Mpa (1Mpa optional).
Effective Welding Area: ≥300mm×300mm.
Formic Acid Reflow Oven — V4DR
Soldering Temperature
Maximum actual soldering temperature ≤ 600℃
Vacuum Level
Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa
Effective Soldering Area
≥ 380 mm × 310 mm
Formic Acid Reflow Oven — V3DR
Soldering Temperature
Maximum actual soldering temperature of the V3DR Formic Acid Reflow Oven ≤ 600℃
Vacuum Level
Ultimate vacuum ≤ 0.3 Pa; Working vacuum: 5 Pa – 200 Pa
Temperature Uniformity
≤ ±1% within the effective soldering area
Effective Soldering Area
≤ 300 mm × 300 mm
Inline Vacuum Formic Acid Oven — V8S
The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint.
The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.
