Vacuum Formic Acid Oven — V8SL

The V8SL vacuum formic acid reflow oven features ultra-low vacuum degree, high throughput, low energy consumption, low nitrogen consumption and compact footprint. Specifically optimized and designed for the semiconductor industry, the V8SL is a dedicated vacuum oven for vacuum welding and packaging of lead frame products, LED products and power devices, addressing various pain points currently faced by industry customers. Core Advantages High throughput: Up to 120-130 frames per hour (calculated based on the welding time of each temperature zone). Low energy consumption: Rated starting power of the whole machine: 18KW; Average operating power: 6KW. Low nitrogen consumption: Only 1/4–1/5 of that of other similar vacuum ovens in the market. Compact footprint: Overall dimensions: 3300×1000×1300mm.

Welding Compatibility Suitable for welding with various solders (≤450℃), including: SAC305 solder paste; Sn63Pb37 solder paste; Sn90Sb10 solder paste; In97Ag3 solder paste; In52Sn48 solder paste and other solder pastes of different compositions. Welding Void Rate Pad void rate: ＜2% Single void rate: 2% Note: Welding performance is affected by different welding materials and atmospheres. The above data is a comprehensive result verified by customers, and specific values may vary for different welding products. Key Performance & Configuration The oven supports a nitrogen atmosphere working environment, meeting the requirements of various welding processes. Equipped with a custom software control system with a modular design and a concise, user-friendly operation interface. Calibration-free design eliminates additional calibration costs during usage. Main electrical components and temperature control design adopt advanced industry-level configurations with superior temperature uniformity, suitable for the soldering of CSP and BGA components. Energy-saving furnace liner: Adopts a heat-insulating and airtight structure for excellent thermal insulation and low power consumption — the average power consumption of industry reflow ovens is 15 kW/h, while the V8SL achieves a 40% energy reduction; calculated based on 24-hour operation, it can save more than 50,000 RMB in energy costs annually. Self-developed stable software system: Realizes online real-time temperature measurement and monitoring of PCBs, supports real-time data analysis, as well as data storage and printing functions. Precision temperature control: Each temperature zone is equipped with forced independent circulation and independent PID control, with separate upper and lower heating methods, ensuring accurate and uniform temperature in the furnace chamber with large heat capacity; rapid temperature rise — warm-up time from room temperature to operating temperature ≤ 20 minutes. Stable transmission & heating system: Imported high-temperature and high-speed motors ensure stable air supply with low vibration and low noise; aluminum alloy guide rails undergo high-temperature processing to prevent deformation. Comprehensive safety protection: Equipped with a power-off protection function, built-in computer and transmission UPS to ensure normal output of PCBs after power failure and avoid workpiece damage. High-quality furnace liner: Made of stainless steel, featuring corrosion resistance and no slag falling, effectively protecting the cleanliness of PCBs during the soldering process. Intelligent status monitoring: Automatic real-time monitoring and display of equipment working status for easy operation and maintenance. Adjustable hot air system: Custom-designed wind wheels ensure stable air speed; the hot air speed of the furnace body is frequency-converted and adjustable, with controllable thermal shock degree. Efficient cooling system: Forced air cooling: Adopts a pressurized forced air cooling structure with a long cooling zone for excellent cooling effect; Circulating water cooling: Cooled by an external industrial water chiller for uniform and rapid cooling; cooling water temperature is adjustable, and the cooling zone temperature is real-time displayable. Precision gas & oxygen monitoring: Equipped with a nitrogen flow meter for real-time nitrogen flow monitoring, and an oxygen analyzer for real-time oxygen content monitoring; the software automatically records oxygen concentration changes for process traceability. Durable furnace chamber seals: A dedicated water cooling module is added to the seals to reduce operating temperature, extend service life, ensure excellent sealing effect and lower replacement frequency.