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    Inline Vacuum Reflow Oven — VRO945-3
    • Inline Vacuum Reflow Oven — VRO945-3

    Inline Vacuum Reflow Oven — VRO945-3

    The VRO945-3 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption. It is specially optimized and designed for the vacuum soldering and packaging needs of lead frame products and CLIP products in the semiconductor industry. It is a carefully engineered vacuum reflow oven developed to address common challenges faced by industry customers.

    The VRO945-3 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption. It is specially optimized and designed for the vacuum soldering and packaging needs of lead frame products and CLIP products in the semiconductor industry. It is a carefully engineered vacuum reflow oven developed to address common challenges faced by industry customers. Core Advantages Ultra-Low Oxygen Content: Oxygen content < 10 PPM. Low Energy Consumption: Total startup power: 18 KW; Average operating power: 6 KW. Low Nitrogen Consumption: Nitrogen usage is only 1/3 that of comparable vacuum ovens. Compact Footprint: Overall dimensions: 1900 × 1000 × 1300 mm. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste, and other solder paste formulations. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: 1% Note: Different soldering materials and atmospheres will affect results. These values are based on comprehensive customer testing and may vary by product. Key Functional Features Supports nitrogen atmosphere operation to accommodate multiple soldering processes. Equipped with a software control system featuring a modular design and an intuitive, user-friendly interface. Requires no calibration, eliminating additional calibration costs.

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    • The VRO945-3 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption. It is specially optimized and designed for the vacuum soldering and packaging needs of lead frame products and CLIP products in the semiconductor industry. It is a carefully engineered vacuum reflow oven developed to address common challenges faced by industry customers. Core Advantages Ultra-Low Oxygen Content: Oxygen content < 10 PPM. Low Energy Consumption: Total startup power: 18 KW; Average operating power: 6 KW. Low Nitrogen Consumption: Nitrogen usage is only 1/3 that of comparable vacuum ovens. Compact Footprint: Overall dimensions: 1900 × 1000 × 1300 mm. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste, and other solder paste formulations. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: 1% Note: Different soldering materials and atmospheres will affect results. These values are based on comprehensive customer testing and may vary by product. Key Functional Features Supports nitrogen atmosphere operation to accommodate multiple soldering processes. Equipped with a software control system featuring a modular design and an intuitive, user-friendly interface. Requires no calibration, eliminating additional calibration costs.

    Inline Vacuum Formic Acid Oven — V8N-9

    The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the specific vacuum soldering and packaging requirements of IGBT modules and MOSFET devices in the power semiconductor industry. This vacuum oven is elaborately engineered to address various challenges encountered by customers in the current industry.

    Vacuum Formic Acid Oven — V8-200-3

    The V8-200-3 Vacuum Formic Acid Reflow Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8-200-3 Vacuum Formic Acid Reflow Oven is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.

    Inline Vacuum Formic Acid Oven — V8S

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    Vacuum Formic Acid Oven — V8SL

    The V8SL Vacuum Formic Acid Reflow Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8SL Vacuum Formic Acid Reflow Oven is specially optimized and designed for the special vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.

    Inline Vacuum Formic Acid Oven — V8N-6

    The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the vacuum soldering and packaging needs of IGBT modules and MOSFET devices in the power semiconductor industry. This is a carefully engineered vacuum oven developed to address common challenges faced by industry customers.
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