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    Inline Vacuum Reflow Oven — VRO945
    • Inline Vacuum Reflow Oven — VRO945

    Inline Vacuum Reflow Oven — VRO945

    The VRO945 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption. It is specially optimized and designed for the special vacuum soldering and packaging requirements of lead frame products and CLIP products in the semiconductor industry. A carefully optimized vacuum reflow oven developed in response to various challenges encountered by customers in the current industry.
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    The VRO945 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption. It is specially optimized and designed for the special vacuum soldering and packaging requirements of lead frame products and CLIP products in the semiconductor industry. A carefully optimized vacuum reflow oven developed in response to various challenges encountered by customers in the current industry. Core Advantages Ultra-low Oxygen Content: Oxygen content ＜ 10 PPM. Low Energy Consumption: Total startup power: 18 KW; Average operating power: 6 KW. Low Nitrogen Consumption: Nitrogen consumption is only 1/3 of that of other similar vacuum oven products. Compact Footprint: Overall dimensions: 1900×1000×1300 mm. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste and other solder paste formulations. Soldering Void Ratio Pad void ratio: ＜ 2% Single void ratio: 1% Note: Different soldering materials and atmospheres will affect the soldering results. The above data is a comprehensive summary based on customer tests, and the specific values may vary for different soldering products. Key Functional Features Supports nitrogen atmosphere working environment to meet a variety of soldering processes. Equipped with a software control system with modular design and a concise, user-friendly operation interface. No calibration is required for the equipment, eliminating additional calibration costs.

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    • Inline Vacuum Reflow Oven — VRO945

    • The VRO945 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption. It is specially optimized and designed for the special vacuum soldering and packaging requirements of lead frame products and CLIP products in the semiconductor industry. A carefully optimized vacuum reflow oven developed in response to various challenges encountered by customers in the current industry. Core Advantages Ultra-low Oxygen Content: Oxygen content ＜ 10 PPM. Low Energy Consumption: Total startup power: 18 KW; Average operating power: 6 KW. Low Nitrogen Consumption: Nitrogen consumption is only 1/3 of that of other similar vacuum oven products. Compact Footprint: Overall dimensions: 1900×1000×1300 mm. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste and other solder paste formulations. Soldering Void Ratio Pad void ratio: ＜ 2% Single void ratio: 1% Note: Different soldering materials and atmospheres will affect the soldering results. The above data is a comprehensive summary based on customer tests, and the specific values may vary for different soldering products. Key Functional Features Supports nitrogen atmosphere working environment to meet a variety of soldering processes. Equipped with a software control system with modular design and a concise, user-friendly operation interface. No calibration is required for the equipment, eliminating additional calibration costs.

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    Inline Vacuum Formic Acid Oven — V8S

    The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.
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    Vacuum Formic Acid Oven — V8SL

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