Inline Vacuum Formic Acid Oven — V8N-9

The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the specific vacuum soldering and packaging requirements of IGBT modules and MOSFET devices in the power semiconductor industry. This vacuum oven is elaborately engineered to address various challenges encountered by customers in the current industry. Core Advantages High Output: Completes soldering of one batch of IGBT modules every 4–10 minutes. Low Energy Consumption: Total startup power: 66 KW; Average operating power: 10–12 KW. Low Nitrogen Consumption: Nitrogen consumption is only 1/2–2/3 of that of other similar vacuum oven products. Compact Footprint: Overall dimensions: 4550 × 1200 × 1620 mm. Solder Compatibility Suitable for soldering with various solders (≤400℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste and other solder paste formulations of all compositions. Soldering Void Ratio Pad void ratio: ＜ 2% Single void ratio: ＜ 1% Note: Different soldering materials and atmospheres will affect the soldering results. The above data is a comprehensive summary based on customer tests, and specific values may vary for different soldering products. Key Functional Features Supports both nitrogen and formic acid atmosphere operation to meet the requirements of multiple soldering processes. Equipped with a software control system with modular design and a concise, user-friendly operation interface. No calibration is required for the equipment, eliminating additional calibration costs.