The RTP series vacuum annealing furnace adopts infrared radiation heating technology to achieve rapid heating and cooling, serving as a professional vacuum annealing equipment. This series features ultra-fast thermal ramp-up and cool-down performance, and is applicable for rapid annealing, rapid thermal processing, rapid oxidation, rapid thermal nitridation as well as metal alloying processes. The RTP300 vacuum annealing furnace adopts top and bottom infrared heating with a proprietary heating tube installation structure, enabling faster heating rate and higher heating temperature uniformity. Meanwhile, the top and bottom heating systems are designed with multi-zone distribution for higher temperature control accuracy. The RTP300 is fully compatible with 12-inch wafer processing and supports downward compatibility for smaller wafer sizes, meeting customers' diverse production requirements for different products. With an ultra-high heating rate, it rapidly heats wafers or materials to a temperature range of 300℃–1000℃, which eliminates internal defects of wafers or materials and optimizes product performance. Application Fields This furnace is suitable for the annealing processes of third-generation semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC). It is widely applied in the production of various chip products including IC wafers, LED wafers, MEMS, compound semiconductors and power devices. It is also used in processes such as ohmic contact rapid alloying, ion implantation annealing, oxide growth, stress relief and densification. Through rapid thermal processing, it optimizes crystal structure and optoelectronic performance, and is characterized by higher technical specifications, more complex processes and stronger special applicability. Core Technical Features Realized annealing in a true vacuum environment with a vacuum level of up to 1 Pa. Pressure holding performance: The chamber vacuum level reaches 30 Pa within 30 minutes (pressure holding starts after pumping down to 5 Pa and closing the valve). Professional software control system for an optimized operational experience. Industry-leading 40-segment programmable temperature control system for customizing optimal process profiles. Customizable annealing processes can be set according to the characteristics of different materials. Equipped with a standard rapid cooling technology for efficient thermal cool-down performance. Online temperature measurement function for real-time monitoring of temperature uniformity in the annealing zone, providing expert-level support for process calibration and optimization. Compatible with nitrogen and other inert gas atmospheres to meet the annealing requirements of different processes. Capable of simultaneous heating of the top and bottom chambers to satisfy specific process demands.
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