The H2S is a large-scale vacuum annealing furnace with a heating plate area of 1100×550 mm, capable of annealing large-size workpieces or batch processing of small-size workpieces. It offers a wide range of applications to meet diverse customer production needs. Core System Configuration Heating System: Equipped with a dedicated heating system for operation in a vacuum environment. Vacuum System: Configured with a direct-coupled high-speed rotary vane dry vacuum pump to quickly achieve a high-vacuum environment in the furnace chamber. Cooling System: Adopts a nitrogen cooling system, ensuring rapid cooling even under high-temperature vacuum conditions. Software System: Supports programmable control of heating and cooling rates, allowing the creation, editing, modification, and storage of customized temperature profiles. Control System: Features a modular software design that enables independent configuration of process profiles, vacuum pumping, atmosphere, and cooling. It also supports process merging for one-click operation. Atmosphere System: Enables flux-free soldering and can be filled with reducing or protective gases such as N₂ and HCOOH. Data Logging System: Provides uninterrupted real-time monitoring and data recording, including software curve logging, temperature profile saving, process and equipment parameter storage, and recall. Safety Protection System: Incorporates 8 safety monitoring and protection functions: over-temperature protection for welded components, overall equipment temperature safety, air pressure over/under alarm, water pressure protection, safe operation protection, cooling water path protection during soldering, liquid level protection, and power failure protection. Key Performance Advantages High Vacuum Performance: Real-time display, control, and adjustment of chamber vacuum level. Rapid Cooling Speed: Independent water cooling and gas cooling units in the chamber enable rapid cooling of welded devices. Low Void Ratio Soldering: Ensures a void ratio of less than 3% for large-area pads after soldering. Multi-Process Compatibility: Meets the requirements of high-temperature vacuum annealing for various materials, as well as high-temperature soldering for high-lead solder, lead-free preformed solder foil, and high-quality vacuum soldering with solder paste. High Production Capacity: The large heating plate enables mass production of devices through large-area soldering.
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