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    Ten-Zone In-Line Nitrogen Formic Acid Oven — N10
    • Ten-Zone In-Line Nitrogen Formic Acid Oven — N10

    Ten-Zone In-Line Nitrogen Formic Acid Oven — N10

    The N10 is a ten-zone in-line nitrogen formic acid oven, which meets customers' production capacity requirements. With an oxygen content of less than 20PPM, it is suitable for high-quality package soldering of frame products and CLIP products.

    The N10 is a ten-zone in-line nitrogen formic acid oven, which meets customers' production capacity requirements. With an oxygen content of less than 20PPM, it is suitable for high-quality package soldering of frame products and CLIP products. The N10 is configured with 10 temperature zones for both upper and lower sections, divided into three major zones: preheating zone, high-temperature soldering zone and cooling zone. The cooling zone is further split into high-temperature cooling zone and low-temperature cooling zone. Each temperature zone is equipped with an independent temperature control system to realize single-zone independent control. This equipment adopts both formic acid process and nitrogen process. The formic acid process can effectively remove the oxide film on welded parts, and the nitrogen atmosphere can prevent workpiece oxidation during the soldering process. In the nitrogen plus formic acid atmosphere, no activators are required in the solder paste used, and no residues remain after soldering, which is extremely beneficial for the soldering of fine-pitch devices. The combination of nitrogen, solder paste and formic acid can break down oxides, obtain a pure surface of the base material, and achieve reliable soldering. Nitrogen reflow oven fills the furnace chamber with nitrogen to block air ingress into the furnace, preventing oxidation of chips and frames during reflow soldering, as well as oxidation during preheating, soldering and cooling processes. Nitrogen reflow oven fills the furnace chamber with nitrogen to block air ingress into the furnace, preventing oxidation of chips and frames during reflow soldering, as well as oxidation during preheating, soldering and cooling processes. Based on the diverse requirements of different customers, Zhongke Tongzhi has developed a variety of nitrogen reflow ovens, among which the N10 is the most representative model. As a multi-zone in-line equipment, the N10 is suitable for high-quality package soldering of frame products and CLIP products. The components adopted for the main electrical parts and the temperature control design reach an advanced level with high uniformity, making it suitable for the soldering of CSP and BGA components. The furnace liner features an energy-saving design with a heat-insulating and airtight structure, ensuring excellent thermal insulation and low power consumption (the average power consumption of reflow ovens in the industry is 15 kW per hour, while the average power consumption of the A9N is only 8.5 kW per hour), achieving a 40% energy reduction. Calculated based on 24 hours of operation per day, it can save more than 50,000 RMB annually. The self-developed software system is stable, reliable and powerful, which enables real-time temperature measurement and monitoring of PCB boards online, conducts data analysis at any time, and supports data storage and printing. Each temperature zone adopts forced independent circulation and independent PID control, with separate upper and lower heating methods, ensuring accurate and uniform temperature in the furnace chamber with large heat capacity. Rapid temperature rise: the time from room temperature to operating temperature is ≤ 20 minutes. Imported high-temperature and high-speed motors ensure stable air supply with low vibration and low noise; the aluminum alloy guide rails are treated with high-temperature processing to prevent deformation. It is equipped with a power-off protection function, with a built-in computer and transmission UPS to ensure the normal output of PCB boards after power failure and avoid damage. The furnace liner is made of stainless steel, which is corrosion-resistant and free of slag falling, protecting the cleanliness of PCB boards during the soldering process. Automatic monitoring and display of equipment working status. Custom-designed wind wheels ensure stable air speed; the hot air speed of the furnace body is adjusted by frequency conversion, and the thermal shock degree is controllable. Forced air cooling is adopted with a pressurized forced air cooling structure, featuring a long cooling temperature zone and excellent cooling effect. Circulating water cooling: cooled by an external industrial water chiller for uniform and rapid cooling; the cooling water temperature is adjustable, and the temperature of the cooling zone is displayable. A nitrogen flow meter allows real-time monitoring of nitrogen flow; an oxygen analyzer enables real-time monitoring of oxygen content, and the software records the changes in oxygen concentration. A water cooling module is added to the furnace chamber seals to reduce the operating temperature, extend the service life, ensure an excellent sealing effect and reduce the replacement frequency.

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    Nitrogen Lead-Free Formic Acid Reflow Oven — A9N-D

    The components adopted for the main electrical parts and the temperature control design reach an advanced level with high uniformity, making it suitable for the soldering of CSP and BGA components. The furnace liner features an energy-saving design with a heat-insulating and airtight structure, ensuring excellent thermal insulation and low power consumption (the average power consumption of reflow ovens in the industry is 15 kW per hour, while the average power consumption of the A9N is only 8.5 kW per hour), achieving a 40% energy reduction. Calculated based on 24 hours of operation per day, it can save more than 50,000 RMB annually.

    Nitrogen Lead-Free Formic Acid Reflow Oven — A12N

    The components adopted for the main electrical parts and the temperature control design reach an advanced level with high uniformity, making it suitable for the soldering of CSP and BGA components.​ The furnace liner features an energy-saving design with a heat-insulating and airtight structure, ensuring excellent thermal insulation and low power consumption (the average power consumption of reflow ovens in the industry is 15 kW per hour, while the average power consumption of the A9N is only 8.5 kW per hour), achieving a 40% energy reduction. Calculated based on 24 hours of operation per day, it can save more than 50,000 RMB annually.
    Computer Control Operate contr...
    The N300 is a bench-top offlin...
    The N10 is a ten-zone in-line ...
    The components adopted for the...
    • The N10 is a ten-zone in-line nitrogen formic acid oven, which meets customers' production capacity requirements. With an oxygen content of less than 20PPM, it is suitable for high-quality package soldering of frame products and CLIP products. The N10 is configured with 10 temperature zones for both upper and lower sections, divided into three major zones: preheating zone, high-temperature soldering zone and cooling zone. The cooling zone is further split into high-temperature cooling zone and low-temperature cooling zone. Each temperature zone is equipped with an independent temperature control system to realize single-zone independent control. This equipment adopts both formic acid process and nitrogen process. The formic acid process can effectively remove the oxide film on welded parts, and the nitrogen atmosphere can prevent workpiece oxidation during the soldering process. In the nitrogen plus formic acid atmosphere, no activators are required in the solder paste used, and no residues remain after soldering, which is extremely beneficial for the soldering of fine-pitch devices. The combination of nitrogen, solder paste and formic acid can break down oxides, obtain a pure surface of the base material, and achieve reliable soldering. Nitrogen reflow oven fills the furnace chamber with nitrogen to block air ingress into the furnace, preventing oxidation of chips and frames during reflow soldering, as well as oxidation during preheating, soldering and cooling processes. Nitrogen reflow oven fills the furnace chamber with nitrogen to block air ingress into the furnace, preventing oxidation of chips and frames during reflow soldering, as well as oxidation during preheating, soldering and cooling processes. Based on the diverse requirements of different customers, Zhongke Tongzhi has developed a variety of nitrogen reflow ovens, among which the N10 is the most representative model. As a multi-zone in-line equipment, the N10 is suitable for high-quality package soldering of frame products and CLIP products. The components adopted for the main electrical parts and the temperature control design reach an advanced level with high uniformity, making it suitable for the soldering of CSP and BGA components. The furnace liner features an energy-saving design with a heat-insulating and airtight structure, ensuring excellent thermal insulation and low power consumption (the average power consumption of reflow ovens in the industry is 15 kW per hour, while the average power consumption of the A9N is only 8.5 kW per hour), achieving a 40% energy reduction. Calculated based on 24 hours of operation per day, it can save more than 50,000 RMB annually. The self-developed software system is stable, reliable and powerful, which enables real-time temperature measurement and monitoring of PCB boards online, conducts data analysis at any time, and supports data storage and printing. Each temperature zone adopts forced independent circulation and independent PID control, with separate upper and lower heating methods, ensuring accurate and uniform temperature in the furnace chamber with large heat capacity. Rapid temperature rise: the time from room temperature to operating temperature is ≤ 20 minutes. Imported high-temperature and high-speed motors ensure stable air supply with low vibration and low noise; the aluminum alloy guide rails are treated with high-temperature processing to prevent deformation. It is equipped with a power-off protection function, with a built-in computer and transmission UPS to ensure the normal output of PCB boards after power failure and avoid damage. The furnace liner is made of stainless steel, which is corrosion-resistant and free of slag falling, protecting the cleanliness of PCB boards during the soldering process. Automatic monitoring and display of equipment working status. Custom-designed wind wheels ensure stable air speed; the hot air speed of the furnace body is adjusted by frequency conversion, and the thermal shock degree is controllable. Forced air cooling is adopted with a pressurized forced air cooling structure, featuring a long cooling temperature zone and excellent cooling effect. Circulating water cooling: cooled by an external industrial water chiller for uniform and rapid cooling; the cooling water temperature is adjustable, and the temperature of the cooling zone is displayable. A nitrogen flow meter allows real-time monitoring of nitrogen flow; an oxygen analyzer enables real-time monitoring of oxygen content, and the software records the changes in oxygen concentration. A water cooling module is added to the furnace chamber seals to reduce the operating temperature, extend the service life, ensure an excellent sealing effect and reduce the replacement frequency.

    Drawer-Type Nitrogen Lead-Free Reflow Oven — T200N

    Computer Control Operate controller parameters through software to improve production efficiency, which can meet the soldering production under the condition of product diversification.

    High-Temperature Nitrogen Reflow Oven — N300

    The N300 is a bench-top offline device suitable for small-batch production, mainly serving laboratories, research institutes and customers with low production capacity requirements.

    Ten-Zone In-Line Nitrogen Formic Acid Oven — N10

    The N10 is a ten-zone in-line nitrogen formic acid oven, which meets customers' production capacity requirements. With an oxygen content of less than 20PPM, it is suitable for high-quality package soldering of frame products and CLIP products.

    Nitrogen Lead-Free Formic Acid Reflow Oven — A9N-D

    The components adopted for the main electrical parts and the temperature control design reach an advanced level with high uniformity, making it suitable for the soldering of CSP and BGA components. The furnace liner features an energy-saving design with a heat-insulating and airtight structure, ensuring excellent thermal insulation and low power consumption (the average power consumption of reflow ovens in the industry is 15 kW per hour, while the average power consumption of the A9N is only 8.5 kW per hour), achieving a 40% energy reduction. Calculated based on 24 hours of operation per day, it can save more than 50,000 RMB annually.

    Nitrogen Lead-Free Formic Acid Reflow Oven — A12N

    The components adopted for the main electrical parts and the temperature control design reach an advanced level with high uniformity, making it suitable for the soldering of CSP and BGA components.​ The furnace liner features an energy-saving design with a heat-insulating and airtight structure, ensuring excellent thermal insulation and low power consumption (the average power consumption of reflow ovens in the industry is 15 kW per hour, while the average power consumption of the A9N is only 8.5 kW per hour), achieving a 40% energy reduction. Calculated based on 24 hours of operation per day, it can save more than 50,000 RMB annually.
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