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    High-Temperature Nitrogen Reflow Oven — N300
    • High-Temperature Nitrogen Reflow Oven — N300

    High-Temperature Nitrogen Reflow Oven — N300

    The N300 is a bench-top offline device suitable for small-batch production, mainly serving laboratories, research institutes and customers with low production capacity requirements.
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    The N300 is a bench-top offline device suitable for small-batch production, mainly serving laboratories, research institutes and customers with low production capacity requirements. The N300 is designed with an automatic door opening and closing structure plus an added door locking function for easy operation. Its sealing structure is upgraded on the basis of traditional bench-top reflow ovens, delivering better overall sealing performance to meet customers' demands for high-quality soldering. In addition, the N300 is equipped with bottom heating, enabling a higher temperature rise rate and a substantial increase in operating temperature. It is also fitted with two sets of temperature control systems. To ensure the equipment's stability during high-temperature soldering, a ventilation system and a built-in cooling circulation system are additionally incorporated into the device. Key Features of Nitrogen Reflow Soldering A. Nitrogen reflow soldering is the process of filling the reflow oven chamber with nitrogen to block air from entering the oven. This prevents the oxidation of component pins during reflow soldering, as well as the oxidation of solder pads and solder during preheating, soldering or cooling processes. B. Nitrogen reflow soldering is mainly used to enhance soldering quality by performing soldering in an environment with extremely low oxygen content (1000 PPM or even lower), thus avoiding component oxidation. Therefore, the primary requirement for nitrogen reflow soldering is to keep the oxygen content as low as possible. C. In accordance with different customer requirements, Zhongke Tongzhi has developed a variety of nitrogen reflow ovens, including bench-top offline devices, bench-top online devices and vertical online devices. The most representative one is the N300, a bench-top offline device ideal for small-batch production scenarios such as laboratories and research institutes.


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    High-Temperature Nitrogen Reflow Oven — N300

    High-Temperature Nitrogen Reflow Oven — N300

    The N300 is a bench-top offline device suitable for small-batch production, mainly serving laboratories, research institutes and customers with low production capacity requirements.
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    High-Temperature Nitrogen Reflow Oven — N300
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    • High-Temperature Nitrogen Reflow Oven — N300


    • The N300 is a bench-top offline device suitable for small-batch production, mainly serving laboratories, research institutes and customers with low production capacity requirements. The N300 is designed with an automatic door opening and closing structure plus an added door locking function for easy operation. Its sealing structure is upgraded on the basis of traditional bench-top reflow ovens, delivering better overall sealing performance to meet customers' demands for high-quality soldering. In addition, the N300 is equipped with bottom heating, enabling a higher temperature rise rate and a substantial increase in operating temperature. It is also fitted with two sets of temperature control systems. To ensure the equipment's stability during high-temperature soldering, a ventilation system and a built-in cooling circulation system are additionally incorporated into the device. Key Features of Nitrogen Reflow Soldering A. Nitrogen reflow soldering is the process of filling the reflow oven chamber with nitrogen to block air from entering the oven. This prevents the oxidation of component pins during reflow soldering, as well as the oxidation of solder pads and solder during preheating, soldering or cooling processes. B. Nitrogen reflow soldering is mainly used to enhance soldering quality by performing soldering in an environment with extremely low oxygen content (1000 PPM or even lower), thus avoiding component oxidation. Therefore, the primary requirement for nitrogen reflow soldering is to keep the oxygen content as low as possible. C. In accordance with different customer requirements, Zhongke Tongzhi has developed a variety of nitrogen reflow ovens, including bench-top offline devices, bench-top online devices and vertical online devices. The most representative one is the N300, a bench-top offline device ideal for small-batch production scenarios such as laboratories and research institutes.


    Drawer-Type Nitrogen Lead-Free Reflow Oven — T200N

    Drawer-Type Nitrogen Lead-Free Reflow Oven — T200N

    Computer Control Operate controller parameters through software to improve production efficiency, which can meet the soldering production under the condition of product diversification.
    High-Temperature Nitrogen Reflow Oven — N300

    High-Temperature Nitrogen Reflow Oven — N300

    The N300 is a bench-top offline device suitable for small-batch production, mainly serving laboratories, research institutes and customers with low production capacity requirements.
    Ten-Zone In-Line Nitrogen Formic Acid Oven — N10

    Ten-Zone In-Line Nitrogen Formic Acid Oven — N10

    The N10 is a ten-zone in-line nitrogen formic acid oven, which meets customers' production capacity requirements. With an oxygen content of less than 20PPM, it is suitable for high-quality package soldering of frame products and CLIP products.
    Nitrogen Lead-Free Formic Acid Reflow Oven — A9N-D

    Nitrogen Lead-Free Formic Acid Reflow Oven — A9N-D

    The components adopted for the main electrical parts and the temperature control design reach an advanced level with high uniformity, making it suitable for the soldering of CSP and BGA components. The furnace liner features an energy-saving design with a heat-insulating and airtight structure, ensuring excellent thermal insulation and low power consumption (the average power consumption of reflow ovens in the industry is 15 kW per hour, while the average power consumption of the A9N is only 8.5 kW per hour), achieving a 40% energy reduction. Calculated based on 24 hours of operation per day, it can save more than 50,000 RMB annually.
    Nitrogen Lead-Free Formic Acid Reflow Oven — A12N

    Nitrogen Lead-Free Formic Acid Reflow Oven — A12N

    The components adopted for the main electrical parts and the temperature control design reach an advanced level with high uniformity, making it suitable for the soldering of CSP and BGA components.​ The furnace liner features an energy-saving design with a heat-insulating and airtight structure, ensuring excellent thermal insulation and low power consumption (the average power consumption of reflow ovens in the industry is 15 kW per hour, while the average power consumption of the A9N is only 8.5 kW per hour), achieving a 40% energy reduction. Calculated based on 24 hours of operation per day, it can save more than 50,000 RMB annually.
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