The V8S/V8H Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8S/V8H is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste and other solder paste formulations of all compositions. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: 2% Note: Different soldering materials and atmospheres will affect the soldering results. The above data is a comprehensive summary based on customer tests, and specific values may vary for different soldering products. Key Functional Features Supports nitrogen atmosphere operation to meet the requirements of multiple soldering processes. Equipped with a software control system with a modular design and a concise, user-friendly operation interface. No calibration is required for the equipment, eliminating additional calibration costs.