Inline Vacuum Formic Acid Oven — V8N-6

The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the vacuum soldering and packaging needs of IGBT modules and MOSFET devices in the power semiconductor industry. This is a carefully engineered vacuum oven developed to address common challenges faced by industry customers. Core Advantages High Output: Completes soldering of one batch of IGBT modules every 4–10 minutes. Low Energy Consumption: Total startup power: 66 KW; Average operating power: 10–12 KW. Low Nitrogen Consumption: Nitrogen usage is only 1/2–2/3 that of comparable vacuum ovens. Compact Footprint: Overall dimensions: 4550 × 1200 × 1620 mm. Solder Compatibility Suitable for soldering with various solders (≤400℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste, and other solder paste formulations. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: < 1% Note: Different soldering materials and atmospheres will affect results. These values are based on comprehensive customer testing and may vary by product. Key Functional Features Supports both nitrogen and formic acid atmosphere operation to accommodate multiple soldering processes. Equipped with a software control system featuring a modular design and an intuitive, user-friendly interface. Requires no calibration, eliminating additional calibration costs.