Soldering Temperature Maximum actual soldering temperature of the V3DM Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.3 Pa; Working vacuum: 5 Pa – 200 Pa Temperature Uniformity ≤ ±1% within the effective soldering area Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height ≤ 100 mm Heating Method Adopts bottom + top infrared radiation heating. The heating plate is a semiconductor-grade graphite-coated silicon carbide platform, which is resistant to deformation during long-term operation. Temperature Rise Rate 150℃/min The V3DM is equipped with upper heating, which not only improves heating efficiency but also ensures more uniform platform temperature, enhancing soldering consistency and quality. Cooling Rate 200℃/min (Range: from no-load maximum temperature to 150℃) Silicon Carbide Heating Platform Adopts a combined air-water cooling method to achieve rapid cooling of the heating plate, increase the cooling rate, and prevent poor device sintering caused by excessive temperature difference during the cooling process. Solder Compatibility Suitable for soldering with various solders (≤ 450℃), including preformed solder foils such as In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37 and Sn62Pb36Ag2 (enabling flux-free eutectic soldering), as well as solder pastes of all compositions. Soldering Void Ratio Validated by numerous customers, the V3DM can control the void ratio to below 2% for soft solder soldering. Optional Positive Pressure Module The furnace can be equipped with an optional positive pressure module (≤ 0.2 Mpa), supporting both positive and negative pressure processes. The positive pressure process can effectively solve the displacement of micro-devices during soldering (e.g., MiniLED, MicroLED) and the flux splashing issue in solder paste processes (e.g., lead frame products). Temperature Control and Measurement System Adopts advanced intelligent temperature control technology with a temperature control accuracy of ±1℃. Allows setting of up to 40 temperature segments for the temperature profile, and is configured with 3 groups of PID settings (6 groups optional) for more precise temperature control, ensuring soldering consistency and reliability. Temperature control is a lagging control, while PID control features predictive regulation, which can improve temperature control accuracy and stability. The furnace chamber is standard equipped with 2 sets of temperature-measuring thermocouples. During operation, the thermocouples can real-time feed back the temperature at any position in the chamber, and the temperature measurement curve is displayed in real time on the control software. This ensures better temperature control of the soldering area and provides support for formulating an optimal process profile. Furnace Chamber Atmosphere The V3DM can be filled with nitrogen (an inert gas) for auxiliary soldering, and also supports reductive atmosphere processes such as formic acid and nitrogen-hydrogen mixture (5% H₂ + 95% N₂). The process atmosphere can be precisely controlled by time or MFC (Mass Flow Controller) to ensure the consistency of each set process execution, and it enables soldering without flux. Software Control System Based on the Windows operating system with simple and easy operation. Supports process programming by setting process parameters such as temperature, time, pressure and vacuum; the software automatically controls the entire soldering process. Allows an unlimited number of process actions in process profile programming to meet complex process requirements. Supports the setting, modification, storage and retrieval of various soldering process profiles for different processes. Built-in analysis function that can analyze process profiles and identify key information such as temperature rise, constant temperature and cooling stages. Automatically records the soldering process and temperature control/measurement curves in real time to ensure the process traceability of devices; all data is automatically saved in the corresponding directory according to the process operation time. Structural Features Adopts a fully automatic closed chamber structure to ensure reliable long-term use. The upper cover closes automatically without causing device displacement, avoiding the impact of device vibration on soldering quality. The single-chamber design supports both heating and cooling processes, and is equipped with an anti-pinch design to protect the safety of operators. The upper cover is equipped with an illuminated viewing window, allowing the observation of the device sintering process via a microscope. The upper cover is automatically lifted and lowered; all operations except manual loading and unloading are completed by automatic software control. The heating plate is made of pure material without additional structures such as cold water pipes, ensuring more uniform temperature. Adopts the water cooling technology of Zhongke Tongzhi: water cooling does not affect the temperature uniformity of the thermal field during heating; each heating plate is equipped with six independent water cooling devices during cooling, ensuring higher temperature uniformity in the cooling process. It is especially suitable for high-quality packaging and soldering such as AuSn eutectic soldering and indium solder eutectic soldering. Additional Structural & Design Features Door Locking Method: Automatic program-controlled locking Heating Tube Installation: The bottom and top heating tubes are installed at a 90° angle, which ensures temperature uniformity, especially at the four edges of the heating plate. Each heating tube is equipped with a quartz sleeve as standard; replacing the heating tube does not affect the vacuum of the furnace chamber, making the operation convenient and fast. Specially designed brackets fix the heating tubes in the center of the quartz sleeves, which can effectively extend the service life of the quartz sleeves. The back of the heating tube is coated with a high-temperature layer to improve heat utilization efficiency. The vacuum furnace chamber is CNC integrally machined, which reduces the risk of welding defects such as incomplete welding and ensures vacuum stability for more than 10 years. The automatic locking device of the vacuum door is CNC integrally machined, which effectively improves the stability of micro-positive pressure and enables long-term use. The cooling piping of the vacuum chamber is CNC integrally machined, eliminating the risk of water leakage caused by welding of cold water pipes in the vacuum chamber. The vacuum chamber is made of special materials and developed based on 12 years of vacuum design and process experience, ensuring a vacuum level of 3×10⁻¹ Pa when equipped with a vacuum oil pump and 1.3 Pa when equipped with a dry vacuum pump.
Standard Configuration Main unit × 1 Industrial-grade touch screen control computer × 1 Corrosion-resistant diaphragm pump (vacuum level: 10 mbar) × 1 Rotary vane pump (for 10 mbar vacuum) × 1 Temperature controller × 1 Pressure controller set × 1 Closed-loop water cooling system set × 1 4-channel temperature measurement module set × 1 Vacuum pressure transmitter × 1 Inert gas/nitrogen control valve set × 1 Water tank × 1 Chiller × 1 Optional Configuration Corrosion-resistant diaphragm pump (vacuum level: 10 mbar) Rotary vane pump (for 10 mbar vacuum) Turbomolecular pump system (for 10 mbar vacuum) Formic acid system (onboard installation) Component fixture 110V power supply system 
English
